Toshiba Silicone Co., Ltd.

Tsuneo Motegi

Yasuji Matsumoto

Kazuhisa Ono

Fumihiko Kobayashi

Kiyoshi Takeda

Mitsuyoshi Hashimoto

Shigeki Matsushita

Shuji Chiba

Kiyoshi Hosokawa

Nobuo Nakamura

A room-temperature curable polyorganosiloxane composition comprising the following components (A) to (C): (A) 100 parts by weight of (1) a mixture of a terminally reactive polyorganosiloxane represented by the formula R.sup.1.sub.a (R.sub.2 O).sub.3-a SiZ[R.sub.2 SiO].sub.n SiR .sup.1.sub.2 ZSi(OR.sup.2).sub.3-a R.sup.1.sub.a ; (2) a silane represented by the formula R.sup.3.sub.b Si(OR.sup.4).sub.4-b or a partially hydrolyzed condensation product thereof; the amount of (A) (1) being from 85 to 100 parts by weight; (B) from 0.01 to 20 parts by weight of a curing catalyst; and (C) from 0.5 to 20 parts by weight of a polycondensation reaction product of an amino group-containing silane represented by the formula X.sub.c Si(WNH.sub.2)Y.sub.3-c and a silazane represented by the formula X.sub.d Y.sub.3-d SiNHSiY.sub.3-d X.sub.d ; where all symbols are defined in the specification.

Room-temperature curable polyorganosiloxane composition

A curable organopolysiloxane composition having condensation-curing properties and ultraviolet-curing properties, comprising (A) a diorganopolysiloxane having a viscosity of 50 to 200,000 cSt, both ends of each molecule thereof being blocked with a silanol group, (B) a silane compound, (C) an (alkyl)acrylic acid derivative, (D) a catalyst for condensation and (E) a sensitizer.

Curable organopolysiloxane composition

A curable polyorganosiloxane composition is disclosed, comprising: (A) 100 parts by weight of polyorganosiloxane having at least two hydroxyl groups or hydrolyzable groups bonded to a silicon atom in the molecule thereof and having a viscosity at 25.degree. C. of 10 to 1,000,000 cSt, (B) 0 to 2,000 parts by weight of polyorganosiloxane having at least two alkenyl groups bonded to a silicon atom in the molecule thereof and having a viscosity at 25.degree. C. of 10 to 1,000,000 cSt, (C) 0.5 to 20 parts by weight of an organosilicon compound having more than 2 (on the average) hydrolyzable groups bonded to a silicon atom in the molecule thereof, (D) 0 to 10 parts by weight of a catalyst for a condensation reaction, and (E) 0.1 to 5 parts by weight of an organic peroxide, wherein at least 0.01 mol % of all organic groups bonded to a silicon atom as contained in (A) to (C) is an alkenyl group. The composition has both condensation reaction curability and ultraviolet ray curability.

Curable polyorganosiloxane composition

Primer composition

A storage-stable, room-temperature-curing polysiloxane composition comprising polydiorganosiloxane having silanol terminal radicals and from 0.5 to 25 parts by weight, per 100 parts by weight of said polydiorganosiloxane, of a curing agent containing from 1.5 to 100 wt. % of silane having the formula ##STR1## wherein R.sup.3 is a substituted or unsubstituted hydrocarbon radical, Q is alkylene or alkylidene, R.sup.4 is ##STR2## wherein R.sup.6 and R.sup.7 are substituted or unsubstituted hydrocarbon radicals, R.sup.5 is hydrogen or a substituted or unsubstituted hydrocarbon radical, n is 1 or 2, a is 0 or 1 and b is 1, 2, 3 or 4, and the balance of the curing agent is tri-acyloxysilane.

Room temperature curing polysiloxane compositions

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Gunma, Japan

Tsuneo Motegi