Toray Silicone Company Limited

Dow Corning Corporation

Tsuneo Hanada

Hideo Shinmi

Yoshitsugu Morita

Ryuzo Mikami

Taro Koshii

Katsutoshi Mine

Toshio Suzuki

What is disclosed are thermosetting epoxy resin compositions containing block siloxane copolymers which are used to induce low internal stress in the cured compositions and to provide coefficients of thermal expansion more closely aligned with the coefficients of thermal expansion of the substrates being molded therewith.

Thermosetting epoxy resin compositions

Provided is a method for preparing a spherical cured product having a diameter of 5 mm or less of a polymer or a polymer composition containing at least 10 wt % of the linear organopolysiloxane blocks represented by the following general formula (1), characterized by curing in an atomized state a curable polymer or a curable polymer composition containing at least 10 wt % of the linear organopolysiloxane blocks represented by the following general formula (1):

Method for preparing a spherical cured polymer or a composition thereof

Integral silicone molded products comprising a unitary structure of a substrate with different phases is made by coating a substrate with a mixture of an alkenyl containing polyorganosiloxane, a polyorganohydrogensiloxane, and an addition-reaction catalyst where at least one component is applied to the substrate and then additional components are applied and diffuse to result in a coating with a polyorganosiloxane phase whose degree of crosslinking is low and a polyorganosiloxane phase whose degree of crosslinking is high and the phase having the low degree of crosslinking is next to the substrate. Such molded products are coated hybrid IC transistors, solar battery modules, and optical fibers.

Method of making integral molded silicone products with different phases

What is disclosed is an improved heat curable molding composition which has increased flowability in the mold. The improvement is gained by the use of a fine, spherical noncrystalline filler along with the normal molding compound fillers.

Heat curable molding composition

What is disclosed are room temperature curable silicone resins which have solvent, heat and weather resistance, mold release properties and water repellency in their cured state. Silicone resins are treated with alkoxylated siloxanes, alkoxysilanes and aminoalkoxysilanes to give these properties.

Room temperature curable silicone resins

An improved thermosetting silicone resin molding composition characterized by consisting essentially of 100 parts by weight of organopolysiloxane resin having organic radical: Si ratio of 1.0:1 to 1.7:1 and containing at least 0.2% by weight of silicon-bonded hydroxyl groups, organohydrogenpolysiloxane containing at least one silicon bonded hydrogen atom in each molecule thereof, said organohydrogenpolysiloxane being in such an amount that the number of the hydrogen atoms per hydroxyl group in said organopolysiloxane is between 0.001 and 0.30, 0.01 to 15 parts by weight of organotin oxide, and 50 to 700 parts by weight of an inorganic filler.

Thermosetting silicone resin molding composition

A method for obtaining water-soluble, silicone-modified alkyd resins is disclosed which allows reproducibility of the resin without the undesirable gelling reaction normally associated with such similar processes.

Growing community of inventors

Ichihara, Japan

Tsuneo Hanada