Mitsubishi Denki Kabushiki Kaisha

Tsuneo Hamaguchi

Kenji Kagata

Osamu Hayashi

Susumu Hoshinouchi

Masanobu Kohara

Goro Izuta

Hirofumi Ohuchida

Mitsunori Ishizaki

A semiconductor device includes projecting electrodes formed on one surface of a wiring substrate so as to have a prescribed height, a semiconductor chip having a thickness smaller than the height of the projecting electrodes, and an electronic component having a thickness larger than that of the semiconductor chip and mounted on the other surface of the wiring substrate so that the wiring substrate is warped to be recessed at the one surface. Thus, the rigidity as well as the spacing between the semiconductor chip and the mounting board are assured. Moreover, the semiconductor device having a logic LSI mounted on both surfaces of a wiring substrate is mounted on a mounting board in a housing with projecting electrodes having a prescribed height interposed therebetween, wherein the wiring substrate is warped to be recessed on the side having the projecting electrodes.

Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal

Semiconductor device, method for manufacturing an electronic equipment, electronic equipment and portable information terminal

A high-speed, high-density, small-sized, low-cost semiconductor device wherein the feeder substrate 2 for supplying power to the semiconductor elements 3 as a bare chip has the containers 2a for containing the semiconductor elements 3, the semiconductor elements 3 are bonded to the wiring layer 1b of the signal transmission substrate 1 for transmitting signals to the semiconductor elements 3 and contained in the containers 2a, the containers 2a are covered with the signal transmission substrate 1, and the signal transmission substrate 1 is superposed upon and bonded to the feeder substrate 2.

Semiconductor device, production method therefor, method for testing

This invention relates to printed circuit boards and a method of fabricating same wherein the input/output terminals are integral with the wiring layer of the printed circuit board. This arrangement allows for a higher density of input/output connections than is possible with conventional printed circuit boards.

Printed circuit board provided with a higher density of terminals for

A liquid crystal display apparatus which realizes a large-scale display by connecting a plurality of liquid crystal panels wherein on an electrode substrate having data bus lines and gate bus lines on one surface are formed extension lines each extending from an end of each of the data bus lines and gate bus lines to the opposite surface of the electrode substrate, and a plurality of the electrode substrates are mounted on a substrate on which electrodes are provided to electrically connect the extension lines of the data bus lines or gate bus lines on one electrode substrate with the corresponding ones on other electrode substrate.

Growing community of inventors

Hyogo, Japan

Tsuneo Hamaguchi