Daikin Kogyo Co., Ltd.

Nippon Telegraph and Telephone Public Corporation

Tsuneo Fujii

Shuzo Hattori

Shinzo Morita

Takayuki Deguchi

Hiroshi Inukai

Toshihiko Amano

Osamu Kogure

Masami Kakuchi

Hiroshi Asakawa

Takaomi Satokawa

A resist material of positive type having a high sensitivity, a high resolving power and an excellent adhesion property to substrates, which comprises a copolymer of a fluoroalkyl acrylate having the general formula: ##STR1## wherein R.sub.1 is methyl group, ethyl group, a halogen-substituted methyl or ethyl group, a halogen atom or hydrogen atom, R.sub.2 is a bivalent hydrocarbon group having 1 to 6 carbon atoms, and R.sub.f is a fluoroalkyl group having 1 to 15 carbon atoms, with an acrylic comonomer selected from the group consisting of a glycidyl acrylate, an acrylic acid, an acrylamide and an .alpha.-cyanoacrylate.

Fluoroalkyl acrylate resist material and process for forming fine resist

A resist film made of thiocarbonyl fluoride polymers which has excellent sensitivity, resolving power and adhesion property to a substrate and can provide a fine resist pattern. The resist pattern is produced by forming the resist film on a substrate, irradiating an ionizing radiation and developing with an organic solvent.

Patterned film of thiocarbonyl fluoride polymer

Resist material and process for forming fine resist pattern

A process for forming a fluoroalkyl acrylate polymer film on a substrate by plasma polymerization. The fluoroalkyl acrylate polymer film has a high sensitivity to high energy rays and an excellent resolving power, and is very useful as a resist film. The plasma polymerized film of the invention has little pinholes, and is endurable to dry etching. A patterned resist film is prepared by irradiating the film with high energy rays to form a latent pattern and developing the latent pattern by either a wet process using a solvent or an oxygen or oxygen-containing gas plasma etching. Also, a pattern can be formed in the film by only electron beam irradiation. The pattern formation can be attained by electron beam delineation without development treatment. The pattern formation by electron beam delineation is promoted by heat treating the delineated film at a temperature not less than the glass transition temperature of the polymer under reduced pressure or by treating the delineated film with hydrogen or an inert gas plasma.

Process for forming film of fluoroalkyl acrylate polymer on substrate

Growing community of inventors

Suita, Japan

Tsuneo Fujii