Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Tsunenori Yoshida

Seiichi Nakatani

Koichi Hirano

Hiroyuki Handa

Yoshihisa Yamashita

Mikinari Shimada

Masakazu Tanahashi

Keiichi Takahashi

Shinji Mino

Yasuhiko Nakada

Kenji Hoshino

Hiroyuki Ishitomi

Yoshihiro Higuchi

Masaki Hasegawa

Emiko Igaki

Takashi Takeuchi

Suzushi Kimura

Tomio Yoshida

Masaaki Kuranuki

Tetsuo Nanno

Munehiro Tabata

Akihiro Ishikawa

Tadashi Kawamata

Kanji Katou

A nonaqueous electrolyte secondary battery according to the present invention includes: a negative-electrode current collector; a negative-electrode active material layerprovided on the negative-electrode current collector; a positive-electrode current collector; a positive-electrode active material layerprovided on a face of the positive-electrode current collectoropposing the negative-electrode active material layer; and at least one inorganic insulating layerprovided between the positive-electrode active material layerand the negative-electrode active material layer, the at least one inorganic insulating layerbeing composed of inorganic particles. The inorganic insulating layercontains no binder.

Nonaqueous electrolyte rechargeable battery

A nonaqueous electrolyte secondary battery according to the present invention includes a positive electrode and a negative electrode which are capable of reversibly occluding and releasing lithium; a resin layer provided between the positive electrode and the negative electrode; a battery case accommodating the positive electrode, the negative electrode and the resin layer; a nonaqueous electrolyte solution filling the battery case; and an insulating layer interposed, at least partially, between the positive electrode and the resin layer, the insulating layer containing aluminum fluoride.

Nonaqueous electrolyte secondary battery and method for manufacturing the same

A film formation method according to the present invention includes the step of forming a film of material powdersby introducing a carrier gasto a first chamberaccommodating the material powdersintermittently and mixing the material powdersand the carrier gasto generate a first aerosol, introducing the first aerosol to a second chamberto generate a second aerosol, and jetting the second aerosol to a third chamberto form a film of the material powders

Film formation method and film formation apparatus

In order to enhance versatility, a chip-type battery having a means for readily identifying a first terminal and a second terminal is provided. The chip-type battery includes: a body having a substantially rectangular parallelepiped shape and contains a plurality of power generating elements in a stack, each element including a sintered material; a first terminal having a first polarity; and a second terminal having a second polarity. The first terminal is provided at a first side face of the body. The second terminal is provided at a second side face of the body located on other than the first side face. The first terminal and the second terminal include different metal materials.

Chip-type battery

The method for manufacturing electrically conductive macromolecules of the present invention is provided by reacting at least a monomer and an oxidizing agent to obtain electrically conductive macromolecules by a chemical polymerization method, the method including reacting the monomer and the oxidizing agent at least in a polymerizing vessel that contains a steam atmosphere. With this method, it is possible to obtain flat, electrically conductive macromolecules (). Thus, it is possible to provide a method and an apparatus for manufacturing electrically conductive macromolecules in which it is possible to combine both low ESR and high capacity in a solid state electrolytic capacitor, realize low losses, and have low current leakage.

Method for manufacturing electrically conductive macromolecules and solid state electrolytic capacitor using electrically conductive macromolecules

A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The layer incorporating the capacitor includes a ferromagnetic layer integrated with at least a portion of a surface of the capacitor, and in the circuit board or the layer incorporating the capacitor a coil is wound around the capacitor, or an inductor component is disposed in parallel with the capacitor. Accordingly, a module incorporating a capacitor in which miniaturization, a higher density and a reduced thickness have been achieved, as well as a method for producing the module and a capacitor used for the module, are provided.

Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor

A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The layer incorporating the capacitor includes a ferromagnetic layer integrated with at least a portion of a surface of the capacitor, and in the circuit board or the layer incorporating the capacitor, a coil is wound around the capacitor, or an inductor component is disposed in parallel with the capacitor. Accordingly, a module incorporating a capacitor in which miniaturization, a higher density and a reduced thickness have been achieved, as well as a method for producing the module and a capacitor used for the module, are provided.

A miniature solid electrolytic capacitor is provided, which is suitable for being disposed within an electrically insulating layer, and is connected to other component using an electrically conductive adhesive with a connection resistance at an anode low and with connection reliability improved. Specifically, the electrolytic capacitor includes a valve metal element for an anodehaving a capacitor forming partA and an electrode lead partB, a dielectric oxide filmformed on the valve element, a solid electrolyte layerformed on the dielectric oxide filmand a charge collecting element for a cathodeformed on the solid electrolyte layer, wherein at least one through holeis formed in the electrode lead partB so as to expose a coreC of the valve metal element, and an exposed portionD of the core is used for connecting portion.

Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same

A circuit component built-in module can be produced by filling a conducting material in through holes of a sheet-like member, stacking the sheet-like member and a metal foil on a circuit component package, and applying heat and pressure to embed the circuit component in the sheet-like member, and patterning the metal foil. The circuit component package includes a mounting member with substrate and wiring pattern and a circuit component. The circuit component includes a component body and external electrode, with the component body being thinner at a portion on which the external electrode is provided. The external electrode is provided on a surface of the circuit component that is opposed to the mounting member, and the component body is in contact with the mounting member.

Method of producing circuit component built-in module with embedded circuit component

A miniature solid electrolytic capacitor is provided, which is suitable for being disposed within an electrically insulating layer, and is connected to a component using an electrically conductive adhesive with a connection resistance at an anode being low and with connection reliability being improved. Specifically, the electrolytic capacitor includes a valve metal element for an anode having a capacitor forming part and an electrode lead part, a dielectric oxide film formed on the valve element, a solid electrolyte layer formed on the dielectric oxide film and a charge collecting element for a cathode formed on the solid electrolyte layer, wherein at least one through hole is formed in the electrode lead part so as to expose a core of the valve metal element, and wherein an exposed portion of the core is used as a connecting portion.

A capacitor is provided so as to include: a capacitor element including a dielectric layer, and an anode and a cathode that are arranged to support the dielectric layer therebetween; a planar anode terminal; and a planar cathode terminal. The anode terminal and the cathode terminal are led out from the capacitor element in a same direction so as to be in parallel with each other, and at least a part of the anode terminal and at least a part of the cathode terminal overlap each other without contact in a direction perpendicular to a terminal plane of at least one terminal selected from the anode terminal and the cathode terminal. A capacitor built-in board using the capacitor also is provided.

Capacitor, laminated capacitor, and capacitor built-in-board

A circuit component package of the present invention includes a mounting member including a substrate and a wiring pattern provided on the substrate, a circuit component including a component body and an external electrode provided at an end of the component body, the circuit component being arranged on the mounting member, and a conductive material that electrically connects the external electrode with the wiring pattern. In the circuit component, the component body is shaped so that a first portion of the component body on which the external electrode is provided is thinner than a second portion of the component body, the second portion being a portion on which the external electrode is not provided, and further, the external electrode is arranged in a region on a side on which the component body is positioned with respect to a reference plane containing a predetermined surface of the component body. The circuit component is arranged on the mounting member so that the component body is in contact with the mounting member. The predetermined surface of the component body is a surface of the component body that is to be opposed to the mounting member when the circuit component is mounted on the mounting member.

Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production

The present invention provides a solid electrolyte capacitor with which both higher capacitance and lower ESR are achieved, as well as a method for manufacturing the same. The manufacturing method includes a step of forming, in a first solution, a first conductive polymer film serving as a portion of a conductive polymer layer, and a step of forming, in a second solution whose pH is lower than the pH of the first solution, a second conductive polymer film serving as another portion of the conductive polymer layer. The first conductive polymer film and the second conductive polymer film are both formed by electrolytic oxidative polymerization or by chemical oxidative polymerization. Thus, the conductive polymer layer includes a first conductive polymer film made of a plurality of particles, and a second conductive polymer film having an average particle size that is larger than the average particle size of those plurality of particles. The second conductive polymer film is formed such that it covers the apertures of the plurality of pores formed in the anode conductor, and the first conductive polymer film is formed such that at least a portion thereof is disposed inside the plurality of pores, or it is arranged as an outermost film of the conductive polymer layer.

Solid electrolytic capacitor and method for manufacturing the same

A capacitor is provided, in which an anode and a cathode are led out in a same direction, whereby ESL and ESR are lowered at high frequencies. This capacitor includes for example: anodes and cathodes that are laminated alternately with at least a dielectric layer intervening therebetween; at least one anode leading-out portion; at least one cathode leading-out portion; an anode terminal; and a cathode terminal. In this capacitor, the anodes are connected electrically to the at least one anode leading-out portion, and the cathodes are connected electrically to the at least one cathode leading-out portion. The at least one anode leading-out portion and the at least one cathode leading-out portion are led out in a predetermined direction. The at least one anode leading-out portion is connected to the anode terminal and the at least one cathode leading-out portion is connected to the cathode terminal.

Capacitor

A solid electrolytic capacitor includes a capacitor element including a capacitance forming portion; an encapsulating resin with which the capacitance forming portion is coated; an anode terminal and a cathode terminal that are provided such that at least a part thereof is outside the encapsulating resin; and a lead. The capacitor element includes an anode, and a dielectric layer and a solid electrolytic layer that are laminated on a portion of the anode in this order. The lead is electrically connected to the solid electrolytic layer. The surface of at least one component selected from the anode and the lead has roughness in at least one connection portion selected from a connection portion between the anode and the anode terminal and a connection portion between the lead and the cathode terminal.

Growing community of inventors

Yawata, Japan

Tsunenori Yoshida