Lenovo (singapore) Pte. Ltd.

Tsunenori Yanagisawa

Takehito Yamauchi

Seita Horikoshi

Akinori Uchino

Fumitake Mizoguchi

Atsushi Ohyama

Mizuki Itoyama

An electronic apparatus includes a first chassis which loads a processing device, a second chassis which is coupled with the first chassis to be rotatably movable relative to each other and a vapor chamber which has a first flexile resin sheet, a second flexible resin sheet and a closed space which is formed between the first resin sheet and the second resin sheet and in which a working fluid is encapsulated, extends from the inside of the first chassis to the inside of the second chassis and transports heat that the processing device generates to the second chassis side.

Electronic apparatus and heat transport device

A chassis member capable of improving manufacturing efficiency is disclosed. The chassis member includes a laminate in which an interlayer is provided between a pair of fiber-reinforced resin plates made of reinforced fiber impregnated with thermoplastic resin. A frame body formed of thermoplastic resin is joined to an edge of the laminate. The edge of the laminate is provided with a thin plate portion thinner than the other portion. The frame body is joined to the thin plate portion.

Method for manufacturing a chassis member

A method for processing a fiber-reinforced resin material is disclosed. A fiber-reinforced resin material is disposed between an upper die having a projection and a lower die having a recess corresponding to the projection. The fiber-reinforced resin material includes reinforced fibers having alternately intersecting warp yarns and weft yarns and are impregnated with a thermoplastic resin. The fiber-reinforced resin material is then heated to soften the thermoplastic resin, and the upper die and the lower die are placed close to each other in order to insert the projection into a gap between the warp yarns and the weft yarns of the reinforced fibers such that the gap between the warp yarns and the weft yarns is expanded to form a through hole.

Method for processing fiber-reinforced resin materials

A chassis member for a chassis of an electronic device is disclosed. The chassis member includes an aluminum alloy layer and an alumite layer serving as an outermost layer of the chassis member and disposed on a surface of the aluminum alloy layer. A grain size of an aluminum alloy in the aluminum alloy layer is between 40 &#x3bc;m and 50 &#x3bc;m.

Growing community of inventors

Kanagawa-ken, Japan

Tsunenori Yanagisawa