Kabushiki Kaisha Shinkawa

Tsuneharu Arai

Osamu Nakamura

Eiji Kikuchi

Shigeru Ichikawa

Shigeru Fuke

Michio Yonemoto

In die bonding in which good dies are bonded to good bonding portions of a bonding object (substrates, tapes, etc) and bad dies are bonded to bad bonding portions of the bonding object, dies on a wafer are successively detected and discriminated by a die detecting camera, dies are classified into good dies and bad dies on the basis of the results of this detection and discrimination, dies are registered on a wafer good/bad status map, and dies registered on the wafer good/bad status map are picked up by a die-transporting nozzle, transferred and bonded according to whether good dies or bad dies are requested based upon detection of bonding portions of the bonding object.

Die bonding method and apparatus

A device for preventing wafer rings from being caught on a pair of guide rails of a wafer ring conveying apparatus, including an open-and-close mechanism which moves the pair of guide rails in a closing direction when a wafer ring is supplied onto the guide rails from the wafer ring cassette so as to correct the rotational orientation and/or offset of the wafer ring.

Wafer ring feeding apparatus

A device for conveying a wafer ring between a wafer ring container and a pellet pick-up device. A pair of guide rails which guide both side edges of a wafer ring that is conveyed by a wafer ring conveying assembly are installed pivotally in a vertical direction near the wafer ring cassette. The guide rails are pivoted so as to take a horizontal position when the conveying of the wafer ring is performed and take a vertical position when the pellet pick-up device is in operation. Thus, the operation of the pellet pick-up device is not hindered by the guide rails.

Wafer ring supply and return device

A device for transporting a die from a die pick-up position to a die placement position in the process of manufacturing, for instance, semiconductor devices, including a slider which is vertically movable, a suction holding nozzle installed on the slider, a feeder screw which causes a horizontal movement of the slider, a transport guide shaft which guides the slider so as to make its horizontal movement, a pair of pivotal swing levers respectively installed above the die pick-up position and the die placement position so as to guide the slider to ascend and descend, and driving cams which cause the pivot motions of the swing levers.

Die transporting device

A device for conveying a wafer ring between a wafer ring container and a pellet pick-up device. The wafer ring having a wafer sheet with semiconductor pellets adhered on it is held at its one end by a pair of claws that is equipped with a sensor for detecting the wafer ring held by the claws. After determining the presence of the wafer ring held by the pair of claws, the claws carry the wafer ring onto the pellet pick-up device and then carries the wafer ring back to the wafer ring container. The sensor can be installed on either one of the pair of the claws.

A pellet pick-up device including a wafer sheet stretching structure that includes a vertical driving assembly which raises and lowers the wafer sheet stretching ring and includes synchronously driven first and second motors which raise and lower portions of the wafer sheet stretching ring that are symmetrical with respect to the center of the wafer sheet supporting ring.

Pellet pick-up device

A bonding apparatus which includes a function of adjusting the height level of an upper limit of a bonding stage including a standard stroke cam which raises and lowers the bonding stage, a cam holder which rotatably supports one end of the standard stroke cam and moves in a horizontal direction, a standard stroke air cylinder which drives the cam holder in a horizontal direction, a roller which is installed on the standard stroke cam, a linear cam which is contacted by the roller of the standard stroke cam, and a motor used for moving the linear cam so that the position of contact with the roller of the standard stroke cam can be changed when the raised position of the bonding stage is adjusted.

Growing community of inventors

Fussa, Japan

Tsuneharu Arai