Ngk Spark Plug Company, Limited

Tsuneaki Takashima

Makoto Origuchi

Jun Otsuka

Kozo Yamasaki

Yusuke Makino

Yukinobu Nagao

Chy Narith

A component built-in wiring board is provided. The component built-in wiring boardincludes a core substrate, a first component, a first built-up layerand a capacitor. The core substratehas a housing holeand the first componentis housed in the housing hole. A component mounting regioncapable of mounting a second componentis provided in a surfaceof the first built-up layer. The capacitorhas electrode layersandand a dielectric layer. The capacitoris embedded in the first built-up layersuch that a first front surfaceand a second front surfacein the electrode layerand a first front surfaceand a second front surfacein the electrode layerare disposed in parallel with the surfaceof the first built-up layer

Component built-in wiring board

A method for manufacturing a wiring board with built-in component. The method provides a secure connection between a component and interlayer insulating layers so that the wiring board with built-in component has excellent reliability. The wiring board is manufactured through a core board preparation step, a component preparation step, an accommodation step and a height alignment step. In the core board preparation step, a core board having an accommodation hole therein is prepared. In the component preparation step, a ceramic capacitor having therein a plurality of protruding conductors which protrudes from a capacitor rear surface is prepared. In the accommodation step, the ceramic capacitor is accommodated in the accommodation hole with the core rear surface facing the same side as the capacitor rear surface. In the height alignment step, a surface of a top portion of the protruding conductor and a surface of a conductor layer formed on the core rear surface are aligned to the same height.

Wiring board with built-in component and method for manufacturing the same

A ceramic member for bonding comprises: a ceramic base which is a sintered ceramic; and a metallic layer formed on the ceramic base by metallization, wherein the metallic layer comprises 70 to 85% by weight of at least one of tungsten and molybdenum and 0.5 to 8.5% by weight of nickel.

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Iwakura, Japan

Tsuneaki Takashima