Sumitomo Mitsubishi Silicon Corporation

Kashiwara Machine Mfg. Co., Ltd.

Tsunco Takeda

Akira Horiguchi

Ken Isobe

Hiroshi Matsumoto

Tomio Fukushima

Kiyohide Murata

Heigo Tanaka

Yoshiaki Uzu

A method of polishing the double sides of a plurality of works simultaneously by rotating a plurality of carriers between upper and lower rotating surface plates, comprising the steps of forming the works () integrally with the carriers () on the outside of a polishing device main body (), feeding the works () onto a rotating surface plate () on the underside of the polishing device main body () with the works formed integrally with the carriers (), injecting liquid such as water from the upper side rotating surface plate when the upper side rotating surface plate is raised after the double sides are polished, holding the plurality of works () on the lower side rotating surface plate () after the double sides are polished, enabling the works () to be discharged automatically from the lower side rotating surface plate (), providing a brush storage part () and a dresser storage part () near the polishing device main body (), and frequently treating a polishing cloth installed on the opposed surfaces of the upper and lower rotating surface plates with a brush and a dresser.

Double side polishing method and apparatus

Growing community of inventors

Kyoto, Japan

Tsunco Takeda