Hitachi, Ltd.

Hitachi Tobu Semiconductor

Tsukui Seiichirou

Sugano Toshio

Suzuki Shigeru

In an SIP type module of the type wherein memory ICs are mounted to both surfaces of a substrate, the present invention provides a face package type memory module wherein packaging is made in an inclined direction in place of vertical packaging of the prior art technique and only the memory ICs mounted to the upper surface side of the substrate are deviated to the positions closer to the end portion of the substrate in order to drastically reduce the packaging height.

Semiconductor device

Semiconductor device having particular mounting arrangement

In an SIP type module of the type wherein memory ICs are mounted to both surfaces of a substrate, the present invention provides a face package type memory module wherein packaging is made in an inclined direction in place of vertical packaging of the prior art technique and only the memory ICs mounted to the upper surface side of the substrate are deviated to the position closer to the end portion of the substrate in order to drastically reduce the packaging height.

Growing community of inventors

Komoro, Japan

Tsukui Seiichirou