Daicel Corporation

Daicel Chemical Industries, Ltd.

Tsukasa Yoshida

Daisuke Ito

Hitomi Tamaoki

Satoru Sumimoto

Toshihiro Tai

Fei Yang

Tatsuya Nakano

Feng Liu

Keizo Inoue

Hiroto Miyake

Takahiro Iwahama

Yoshinori Funaki

Mitsuru Ohno

Takayuki Yaegashi

Yoshimichi Okano

Michiyo Nakai

Yusuke Okamoto

Kouji Nakatani

Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (T) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.

Curable compound

Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, Rand Reach represent a curable functional group, and Dand Deach represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Arto Areach represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents —CO—, —S—, or —SO—, and Y represents —S—, —SO—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

Curable composition

There is provided a curable compound having good solvent solubility and being capable of forming a cured material having super heat resistance. The curable compound according to the present invention is represented by the following formula (1). In the formula (1), Rand Reach represent a curable functional group; Dand Deach represent a single bond or a linking group; and L represents a divalent group having a repeating unit containing a structure represented by the following formula (I) and a structure represented by the following formula (II) (wherein Arto Areach represent a group made by eliminating two hydrogen atoms from a structural formula of an aromatic ring or a group made by eliminating two hydrogen atoms from a structural formula in which two or more aromatic rings are bound through a single bond or a linking group; X represents &#x2014;CO&#x2014;, &#x2014;S&#x2014; or &#x2014;SO&#x2014;; each Y represents &#x2014;S&#x2014;, &#x2014;SO&#x2014;, &#x2014;O&#x2014;, &#x2014;CO&#x2014;, &#x2014;COO&#x2014; or &#x2014;CONH&#x2014;; and n represents an integer of 0 or more): 

Disclosed is an oxetane-containing vinyl ether compound including one or more aromatic or non-aromatic carbocycles and/or two or more vinyl ether structures, such as a compound of Formula: wherein Ring Zis non-aromatic carbocycle; Ris vinyl group of Formula: wherein each of R, R, and Ris hydrogen or C1-C4 alkyl; Wis single bond or organic group having a valence of (m+1); Xis, for example, hydrocarbon; 'm' and 'q' are each 1 or 2; and &#x201c;p&#x201d; is 0 to 5. Also disclosed is an alicyclic epoxy-containing vinyl ether compound of Formula: wherein Ring Zis non-aromatic carbocycle; Ris vinyl group of Formula: wherein R, Rand Rare each hydrogen or C1-C4 alkyl; Wis single bond or organic group having a valence of (r+1); Rand Rare hydrogen or alkyl; and &#x201c;r&#x201d; and &#x201c;s&#x201d; are 1 or 2.

Vinyl ether compounds and polymerizable compositions

Growing community of inventors

Himeji, Japan

Tsukasa Yoshida