Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Tsukasa Shiraishi

Yoshihiro Bessho

Kazuyoshi Amami

Seiichi Nakatani

Kazuo Eda

Hiroaki Takezawa

Keiji Onishi

Yutaka Taguchi

Osamu Kawasaki

Masahiro Ono

Tsutomu Mitani

Yoshifumi Nakamura

Minehiro Itagaki

Yukihiro Ishimaru

Hideki Iwaki

Shun-ichi Seki

Masayoshi Koyama

Koichi Hirano

Seiji Karashima

Norihito Tsukahara

Satoru Tomekawa

Toshiyuki Kojima

Tatsuo Ogawa

Hiroki Yabe

Shinobu Masuda

Takayuki Hirose

Keiko Ikuta

Seiichi Natkatani

Kazuyoshi Amani

A semiconductor device () includes: a semiconductor chip () having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate () opposed to the first main surface; a first electrode () disposed between the first main surface and the heat dissipating plate () so as to be electrically connected to the semiconductor chip (); a pressure contact member () opposed to the second main surface; a second electrode () disposed between the second main surface and the pressure contact member () so as to be electrically connected to the semiconductor chip (); and a pressure generating mechanism that generates a pressure for pressing the first electrode () into contact with the heat dissipating plate () and the semiconductor chip () and pressing the second electrode () into contact with the pressure contact member () and the semiconductor chip ().

Semiconductor device and method for manufacturing the same

A wiring board connection method comprising: arranging a continuous conductive joint body on adjacent connection terminals of one of the wiring boards in a space between the adjacent connection terminals on one of the wiring boards; aligning the wiring boards so that the connection terminals face each other with the conductive joint body interposed therebetween; and bonding the connection terminals with each other by heating and then cooling the conductive joint body, wherein: the conductive joint body is a material that generates air bubbles upon being heated; and a recessed portion is formed on a surface of at least one of the connection terminals, the surface being opposite to the connection terminal of another wiring board. When the connection terminals are bonded with each other, the conductive joint body is allowed to move so as to gather on the surfaces of the connection terminals where no recessed portions are formed.

Wiring board connection method

A circuit boardhaving a base materialand an electrodeformed on at least one main surface of the base materialincludes an easy peeling portionformed in at least one of an inner portion and a side portion of the electrode, with the adhesive strength between the electrodeand the easy peeling portionbeing less than the adhesive strength between the electrodeand the base material. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.

Circuit board, method for manufacturing the same, and semiconductor device

A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film

Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive correction film

One of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal and the connecting terminal are made to abut each other so that one of the wiring substrate and the electronic component, whichever is not secured, is held. The electronic component is heated so that the solder melts, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XY&#x3b8; direction.

Electronic component mounting method and electronic component mounting device

A highly reliable, high-productivity package equipped with a semiconductor chip, and a method for producing the same. In a package () comprising a semiconductor chip () and a mounting substrate (), a plurality of electrode terminals () are formed on the surface () of the semiconductor chip () opposing the mounting substrate side, connection terminals () respectively corresponding to the plurality of electrode terminals (), are formed on the mounting substrate (), the connection terminals () on the mounting substrate () and the electrode terminals () are electrically connected collectively by solder bumps () formed in self-assembly, an electrode pattern () not connected with the electrode terminals () and the connection terminals () is formed on the chip surface () or the surface () of the mounting substrate () corresponding to the chip surface (), and solder () is accumulated on the electrode pattern ().

Package equipped with semiconductor chip and method for producing same

The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input/output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.

Semiconductor device, mounting circuit board, method of producing the same, and method of producing mounting structure using the same

A mounting structure is formed by flip-chip mounting a semiconductor device onto a substrate. An electrical connecting portion of the semiconductor device is connected to an electrical connecting portion of the substrate by means of an electrically conductive adhesive. A region of the semiconductor device which is not involved in electrical connection is bonded to a region of the substrate which is not involved in electrical connection by means of an adhesive. A test of electrical properties is performed on the semiconductor device and the substrate which are connected to each other. If it is determined that the electrical properties are poor in the test, the semiconductor device is separated from the substrate after heating a bonding place of the adhesive up to a temperature higher than a glass transition point or a melting point of the adhesive. If it is determined that the electrical properties are good in the test, the semiconductor device and the substrate are sealed by means of a sealing resin.

Method of producing mounting structure and mounting structure produced by the same

A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.

Semiconductor device including wiring board with three dimensional wiring pattern

A method for producing a printed-circuit board includes forming via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via holes with a conducting paste; compressing the prepreg under heat to cure the prepreg and the paste; and then peeling off the parting film. Thus, projection electrodes with a height corresponding to the thickness of the film are formed in a manner such that the projection electrodes are integrated with the via hole conductors.

Method for producing a printed-circuit board having projection electrodes

Semiconductor device including a wiring board and semiconductor elements mounted thereon

A semiconductor apparatus in which the height of the projected electrode ( ) formed on the semiconductor element ( ) is deformed plastically so as to unify the distance of the protruding surface of the projected electrode ( ) and the surface of the electrode terminal ( ) at the side of the circuit substrate ( ), and the semiconductor element and the circuit substrate are connected electrically with reliability. A method for producing the semiconductor apparatus also is disclosed. After the semiconductor element ( ) is positioned on the predetermined part of the circuit substrate ( ), the projected electrode ( ) is deformed plastically by pushing the semiconductor element ( ) from the back and the height of the projected electrode ( ) is processed appropriately. According to the method for producing the semiconductor apparatus, even if there is irregularity of the height of the surface of the electrode terminal ( ) formed on the circuit substrate ( ) which connects with the semiconductor element ( ), the semiconductor element ( ) and the circuit substrate ( ) can be connected electrically with reliability.

Flip chip semiconductor apparatus with projecting electrodes and method for producing same

For the reliability in insulation and against sulfurization, the mounting structure of the invention includes an electric structure, and an electrically conductive adhesive layer including an electrically conductive filler disposed on the electric structure, and at least a portion of surface of the electrically conductive filler is exposed to an external environment, and an elution preventive film is disposed on at least a portion of the exposed surface. Further, an electrically conductive adhesive of this invention includes the electrically conductive filler, and an elution preventive film is disposed on the entire surface of the electrically conductive filler.

Growing community of inventors

Osaka, Japan

Tsukasa Shiraishi