Sharp Kabushiki Kaisha Corporation

Xiamen San'an Optoelectronics Co., Ltd

Tsukasa Inoguchi

Masatsugu Masuda

Masaaki Katoh

Masanori Watanabe

Taiji Morimoto

Shin Itoh

Yoshinobu Nakamura

Masahiro Ikehara

Masato Sumikawa

Nobuhiro Nishiyama

Yuhichi Memida

A light-emitting apparatus includes an LED element substrate containing a wiring pattern provided on a surface side of the substrate, at least one light-emitting device mounted on amounting area of the substrate and electrically connecting to the wiring pattern, a connecting substrate provided on the LED element substrate, and a transparent member provided over a top surface of the light-emitting device. The connecting substrate has a light-transmitting section provided in a position corresponding to a position of the light-emitting device to suppress the broadening of light emitted from the light-emitting device. The light-transmitting section causes the light from the light-emitting device to pass through or to transmit.

Light-emitting apparatus

A light-emitting package includes a substrate having a mounting area, one or more light-emitting devices mounted on the mounting area of the substrate, a transparent resin section having a light transmitting property for sealing the one or more light-emitting devices, and a light-reflective member molded on one part of the substrate, which is outside the mounting area on which the one or more light-emitting devices are mounted. There is a distance greater than zero between the light-reflective member and the mounting area.

Light-emitting package

A light-emitting apparatus package of the present invention includes (i) an electrically insulated ceramic substrate, (ii) a first concave section formed in the direction of thickness of the ceramic substrate so as to form a light exit aperture in a surface of the ceramic substrate, (iii) a second concave section formed within the first concave section in the further direction of thickness of the ceramic substrate so that one or more light-emitting devices are provided therein, (iv) a wiring pattern for supplying electricity, which is provided in the first concave section, and (v) a metalized layer having light-reflectivity, which is (a) provided between the light-emitting device and the surface of the second concave section of the substrate, and (b) electrically insulated from the wiring pattern. On the account of this, the light-emitting apparatus package in which heat is excellently discharged and light is efficiently utilized and a light-emitting apparatus in which the light-emitting apparatus package is used can be obtained.

A light-emitting device includes a light-emitting element for emitting primary light, and a wavelength conversion unit for absorbing part of the primary light and emitting secondary light having a wavelength longer than that of the primary light, wherein the wavelength conversion unit includes plural kinds of phosphors having light absorption characteristics different from each other, and then at least one kind of phosphor among the plural kinds of phosphors has an absorption characteristic that can absorb the secondary light emitted from at least another kind of phosphor among the plural kinds of phosphors.

Light emitting device and fabricating method thereof

A light-emitting apparatus package of the present invention includes (i) an electrically insulated ceramic substrate, (ii) a first concave section formed in the direction of thickness of the ceramic substrate so as to form a light exit aperture in a surface of the ceramic substrate, (iii) a second concave section formed within the first concave section in the further direction of thickness of the ceramic substrate so that one or more light-emitting devices are provided therein, (iv) a wiring pattern for supplying electricity, which is provided in the first concave section, and (v) a metalized layer having light-reflectivity, which is (a) provided between the light-emitting device and the surface of the second concave section of the substrate, and (b) electrically insulated from the wiring pattern.

Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus

Light emitting device provided with a wavelength conversion unit incorporating plural kinds of phosphors

In the line light source device and the plane light emission device, first recessesare formed between adjoining light emission elements, on surfaces of sealing resin layersopposite to the board. The line light source device and the plane light emission device, in which the light emission elements are coated with resin, have a simple configuration and high uniformity in luminous intensity in an emission end face of the device.

Line light source device, plane light emission device, plane light source device, and liquid crystal display

A semiconductor light emitting device of the present invention includes a plurality of light emitting elements, a package body for storing the light emitting elements, wiring patterns being electrically connected to the light emitting elements, and Au wires for electrically connecting the light emitting elements and the wiring patterns, the package body including mounting concave portions for storing the respective light emitting elements, and storing concave portion for storing the mounting concave portions and the Au wires, the mounting concave portions being aligned on a linear line and spaced from each other with an equal pitch. In the above arrangement, as the semiconductor light emitting device of the present invention, it is possible to provide a semiconductor light emitting device having a high directional characteristic of emitted light, and a backlight device for a liquid crystal display, the backlight device using the semiconductor light emitting device and having an improved brightness of the emitted light.

Backlight device for liquid crystal display including a plurality of light emitting diodes within their own concaves aligned in a straight line within a larger concave

Growing community of inventors

Kitakatsuragi-gun, Japan

Tsukasa Inoguchi