Honda Motor Co., Ltd.

Sumitomo Wiring Systems, Limited

Tsukasa Aiba

Shinya Watanabe

Takahiro Hagimoto

Tadahiro Fukushima

Fumitomo Takano

Hiroshi Otsuka

Takeshi Ishibashi

Joji Nakashima

Takahide Hashimoto

Hitoshi Saika

Masami Ogura

Tatsuya Choji

Hiroki Yamada

Hiroshi Takei

Jun Kato

Yasuhiko Kondo

Yuko Yamada

Takashi Fukuda

Jun Masuda

Takahito Takayanagi

Eiichirou Urabe

Kaoru Fukui

Hidetoshi Katou

Tsugio Masuda

A hybrid vehicle driving system includes: a generator; a motor; a case which accommodates the generator and the motor; and a power control unit for controlling the generator and the motor, the generator and the motor being disposed side by side on a same axis within the case. The power control unit is mounted on the case by connecting a unit-side generator connector and a unit-side motor connector which are provided on a bottom surface of the power control unit with a case-side generator connector and a case-side motor connector which are disposed on the case, directly and respectively. The case is fixed to a vehicle framework member via a mount member, and a fixing point where the case and the mount member are fixed together is disposed near the case-side generator connector and the case-side motor connector.

Hybrid vehicle driving system

An integrated system includes a controller, a drive device, and a fastening supporting member. The controller has a controller connector. The drive device has a drive device connector which is connected to the controller connector so that the drive device is electrically coupled to the controller. Via the fastening supporting member, the controller and the drive device are maintained in an electrically coupled state in which the drive device connector is connected to the controller connector. At least part of the controller connector and the drive device connector, as viewed from a vertical direction, is disposed within an area from a first line segment which is perpendicular to a virtual line connecting a center of gravity of the controller and the fastening supporting member and which passes the center of gravity to a second line segment which is perpendicular to the virtual line and which passes the fastening supporting member.

Integrated system

A connector device includes a motor-side connectorincluding a motor-side terminal, an inverter-side connectorincluding an inverter-side terminal, a motor caseincluding the motor-side connector, and an inverter caseincluding the inverter-side connector, the connectorsbeing fitted together when the inverter caseis stacked on and fastened to the motor caseusing bolts. When the fastening of the casesis completed, a predetermined gap is ensured between opposing surfacesB,A of the connectors

Connector device

An integrated system includes a controller, a drive device, a fastening supporting member, and a fixing member. The controller has a controller connector. The drive device has a drive device connector that is connected to the controller connector so that the drive device is electrically coupled to the controller. Via the fastening supporting member, the controller and the drive device are maintained in an electrically coupled state in which the drive device connector is connected to the controller connector. Via the fixing member, the controller and the drive device are maintained in a mechanically coupled state in which the drive device is mechanically coupled to the controller.

A device connectorto be attached to a case C of a device includes: a housingto be fitted in an attachment hole Cof the case C; a seal grooveprovided in an inner housingconstituting the housing, and having a back surfacedisposed opposite an outer peripheral edge portion Cof the attachment hole Cof the case C; a face sealfitted in the seal grooveto waterproof a gap between the outer peripheral edge portion Cof the attachment hole Cand the back surface of the seal groove; and a relief groovedisposed adjacently outside the seal groovein an outer housingconstituting the housingand along the seal groove, and recessed upward relative to a lower surface of the tubular portionof the outer housing

Device connector

A motor case () has connectors () fixed at motor case mounting holes (), and an inverter case () has connectors () radially movable at inverter case mounting holes (). The inverter case () is mounted on the motor case () so that the connectors () fit together. A surface seal () is disposed on a lower surface of a flange () at an outer periphery of a housing () of the motor-side connectors (), and is compressed elastically against an upper surface of the motor case () at an outer periphery of the motor case mounting holes (). A metal pressing member () is fixed on the motor case () and presses the flange (). An axial seal () is fit on the outer periphery of the housing () and is compressed elastically between the outer periphery and an inner periphery of the second mounting hole ().

A power converter including a switching element, a switching power module containing a driving circuit for driving the switching element, a smoothing capacitor module for smoothing an input to the switching power module, and a heat sink for cooling the switching power module, wherein the switching power module is mounted on the heat sink, and the smoothing capacitor module is provided on a side surface of the heat sink.

Power converter

There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.

Semiconductor device having thermal endurance and method of manufacturing the same

A semiconductor device is composed of a pair of semiconductor chips () arranged parallel on the same flat plane; a high voltage bus bar () bonded on the surface on the collector side of one semiconductor chip (); a low voltage bus bar () connected to the surface on the emitter side of the other semiconductor chip () with a bonding wire (); a first metal wiring board (-) connected to the surface on the emitter side of the semiconductor chip () with a bonding wire (); a second metal wiring board (-) bonded on the surface on the collector side of the semiconductor chip (); a third metal wiring board (-) connected to the first metal wiring board (-); a fourth metal wiring board (-) connected by being bent from an end portion of the second metal wiring board (-); and an output bus bar () having output terminals () extending from each end portion of the third metal wiring board (-) and that of the fourth metal wiring board (-).

Semiconductor device

A semiconductor device includes first and second assembled bodies (A,B). The first assembled body is provided with a first semiconductor chip, a high voltage bus bar () connected to one surface of the first semiconductor chip, a first metal wiring board (-) connected to the other surface of the first semiconductor chip with a bonding wire, and a third metal wiring board (-) connected to the first metal wiring board. The second assembled body is provided with a second semiconductor chip, a low voltage bus bar () connected to one surface of the second semiconductor chip with a bonding wire, a second metal wiring board (-) connected to the other surface of the second semiconductor chip, and a fourth metal wiring board (-) connected by being returned from an end portion of the second metal wiring board and arranged in parallel to the second metal wiring board. The first assembled body and the second assembled body are arranged in a stacked structure wherein the assembled bodies are being separated. Inductance of a main circuit is reduced by the semiconductor module structure.

Growing community of inventors

Wako, Japan

Tsukasa Aiba