A-sat Corporation

Tsui Yee Lin

Chun Ho Fan

Kin Pui Kwan

Wing Him Lau

Shui Ming Tse

Shuk Man Wong

Neil McLellan

Kin Yan Tsang

Ping Sheung Lau

A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a semiconductor die on another portion of the first leadframe.

Multiple leadframe laminated IC package

A process for fabricating a leadless plastic chip carrier includes providing a leadframe including a plurality of contacts circumscribing a void; fixing a heat sink to the contacts of the leadframe using an intermediate non-electrically conductive adhesive such that the heat sink spans the void; mounting a semiconductor die to the heat sink in the void; wire bonding ones of the contacts to the pads of the semiconductor die; encapsulating the semiconductor die and the wire bonds in a molding material and singulating the leadless plastic chip carrier.

Leadless plastic chip carrier and method of fabricating same

A leadless plastic chip carrier comprising a die attach pad, a semiconductor die mounted to a portion of the die attach pad and at least one row of contact pads circumscribing the die attach pad. The row of contact pads have a thickness greater than the thickness of the portion of the die attach pad. A plurality of wire bonds connect the die attach pad and the contact pads. An overmold covers the semiconductor die and all except one surface of the at least one row of contact pads and the die attach pad.

Leadless plastic chip carrier with partial etch die attach pad

Growing community of inventors

Hong Kong, China

Tsui Yee Lin