Eternal Chemical Co., Ltd.

Epoch Material Co., Ltd.

Tsui-Ping Yeh

Tsung-Ho Lee

Kang-Hua Lee

Hung-Wen Chiou

The invention provides a chemical mechanical abrasive composition for use in semiconductor processing, which comprises phosphorous acid and/or a salt thereof as an abrasive enhancer. The chemical mechanical abrasive composition of the invention can be in the form of a slurry which comprises 70-99.5% by weight of an aqueous medium, 0.1-25% by weight of an abrasive, and 0.01-2% by weight of said abrasion enhancer. The chemical mechanical abrasive composition of the invention may further comprise an abrasion co-enhancer selected from an amino acid, a salt thereof, a carboxylic acid, a salt thereof, or a mixture of the acids and/or salts.

Chemical mechanical abrasive composition for use in semiconductor processing

Chemical-mechanical abrasive composition and method

The invention provides a chemical-mechanical abrasive composition for semiconductor processing, which composition is characterized by comprising a water-soluble anionic chemical. According to the invention, said water-soluble anionic chemical would be coated on the surface of a metal film during the polishing of said metal film so as to inhibit the formation of depressions on the resultant metal circuits. In another aspect, the invention provides a chemical-mechanical abrasive composition in the form of a slurry comprising 70-99.5% by weight of an aqueous medium; 0.1-25% by weight of an abrasive particle; 0.01-2.0% by weight of an abrasion enhancer; and 0.01-1% by weight of a water-soluble anionic chemical. The chemical-mechanical abrasive composition of the invention may further comprise an oxidant to enhance the abrasion rate.

The invention provides a chemical-mechanical abrasive composition for use in semiconductor processing, which comprises 70-95% by weight of an aqueous medium, 1-25% by weight of an abrasive, 0.1-20% by weight of an abrasion accelerator, wherein the abrasion accelerator comprises monocarboxy group- or an amido group-containing compound and optionally a nitrate salt. The chemical-mechanical abrasive composition of the invention can further comprise an anionic surfactant, e.g. polycarboxylic acid or polyacrylic acid copolymer, so as to reduce the viscosity of the abrasive composition.

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Kaohsiung, Taiwan

Tsui-Ping Yeh