Wintek Corporation

Tsui-Chuan Wang

Chin-Mei Huang

Chun-Yi Wu

Shih-Cheng Wang

Pei-Fang Tsai

Ying-Fang Xu

Han-Chung Chen

Ning-Hua Li

A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

Bonding pad structure

The present invention discloses a flexible printed circuit (FPC) layout and a method thereof. The flexible printed circuit (FPC) layout method comprises steps of: providing a circuit board body; disposing at least an electroplating point on the circuit board body; disposing a plurality of solder pads on the circuit board body, the plurality of solder pads comprising at least a first solder pad and at least a second solder pad being connected respectively to the electroplating point through an internal wire, the first solder pad being further connected to an electroplating zone on the circuit board body through an external wire; performing an electroplating process from the electroplating zone through the external wire so that the external wire, the first solder pad connected to the external wire, the electroplating point connected through the internal wire to the first solder pad, and the second solder pad connected through the internal wire to the electroplating point are electroplated and electrically connected; and providing at least a via hole at the electroplating point on the circuit board body to form an open circuit between the first solder pad and the second solder pad. By using the disclosed method, the flexible printed circuit layout of the present invention can be formed.

Flexible printed circuit layout and method thereof

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Taichung County, Taiwan

Tsui-Chuan Wang