Hitachi Automotive Systems, Ltd.

Astellas Pharma Gmbh

Hitachi, Ltd.

Hitachi Astemo Ltd.

Tsubasa Watanabe

Takayuki Yogo

Hiroaki Hoshika

Tsutomu Kono

Shinobu Tashiro

Takahiro Miki

Akira Uenodan

Noboru Tokuyasu

Hiroshi Shibata

Takeshi Morino

Norio Ishitsuka

Yuji Koga

Kazuhiko Ohne

Masatoshi Ogata

Eisuke Nozawa

Takeshi Hanazawa

Masashi Fukaya

Ippei Sato

Kyoichi Maeno

Shunichiro Hachiya

Tomoaki Saito

Hiroki Nakatsuchi

Yoshimasa Imamura

Ryotaro Shimada

Kenichiro Imamura

Toshio Kurosaki

Ryo Mizoguchi

Maiko Iida

Hiroki Ishioka

Provided is a thermal-type flowmeter which can prevent a reduction of flow rate accuracy and reliability, and an increase of cost of the thermal-type flowmeter compared to the related art, and can add a function of an electrostatic scattering mechanism. The thermal-type flowmeter of the present invention includes a sub-passage into which part of a measurement target gas flowing in a main passage is taken, a flow rate detection element of a flow measurement unit which is disposed in the sub-passage, a circuit package which supports the flow rate detection element, and a substrate to which the circuit package is fixed. The flow rate detection element includes a detection surface to detect a flow rate of the measurement target gas. The detection surface is disposed to face the circuit substrate.

Thermal-type flowmeter

A thermal flowmeter includes a plurality of measuring units for stabilizing air flowing in a sub-passage, and improves noise performance or a pulsation characteristic of a flow rate sensor. The thermal flowmeter includes a flange fixed to an attachment part of a main passage, a sub-passage takes in a part of measured gas flowing in the main passage, a flow rate measuring unit measures a flow rate of the measured gas in the sub-passage, a circuit component controls the flow rate measuring unit, and the flow rate measuring unit and an electronic component are mounted on a circuit substrate. The sub-passage is formed in a substrate of the circuit substrate, the sub-passage on a surface side of the circuit substrate and a second space on a rear surface side are separated by the circuit substrate, and a pressure measuring unit and the circuit component are arranged in the second space.

Thermal flowmeter

To obtain a physical quantity detection apparatus that can reduce the outer shape of a housing in size. A physical quantity detection apparatusdetects a plurality of physical quantities of gasto be measured flowing in a main passage. The physical quantity detection apparatushas a housingdisposed in the main passage, a circuit substrateinsert molded in the housing, and a plurality of detection sensors, andeach mounted on each of one face and the other face of the circuit substrate

Physical quantity detection apparatus and electronic apparatus

Provided is a flow analysis method capable of predicting a flow state of a composite resin material by taking into account a change in filler dispersion degree of the composite resin material. In a flow analysis method for a composite resin material having a filler and a resin, in a certain process of identifying a region in which the composite resin material flows and analyzing a flow, an exothermic reaction speed of the composite resin material in the region is computed using a filler dispersion degree in the composite resin material, a temperature and the filler dispersion degree of the composite resin material in the region is computed using the computed exothermic reaction speed, and an exothermic reaction speed in a process subsequent to a process is computed using the computed filler dispersion degree.

Flow analysis method

A physical quantity detection device includes: a housing; a circuit board; a resin material which covers the circuit board; a cover which forms a circuit chamber in which the circuit board is disposed and a flow path through which a gas to be measured passes together with the housing; and a conductor which is disposed to be exposed to the flow path, in which the conductor and the circuit board are electrically connected to each other.

Physical quantity detection device

To obtain a flow meter with which it is possible to facilitate establishing an electrical connection with a conductor exposed in a location through which a gas to be measured passes. A flow meter that is provided with a lead and a circuit component placed on the lead, and that has a package in which part of the lead is molded from a resin, wherein the package is provided with an exposure portion for exposing part of the lead from the resin member, the exposure portion being electrically connected to a conductor that constitutes part of an auxiliary passage.

Flow meter

A semiconductor module includes: a circuit board on which a first semiconductor chip and a second semiconductor chip are mounted and includes a first through hole formed with a conductor foil therein; a press-fit terminal that is electrically connected to the conductor foil in the first through hole of the circuit board; and a second resin that is disposed on a surface side and a back surface side of the circuit board. Further, the press-fit terminal is provided with a pressure contact portion which is press-fitted into the first through hole and is electrically connected to the conductor foil in the first through hole, and the second resin on the surface side of the circuit board and the second resin on the back surface side of the circuit board are integrally formed via a second resin that is filled in the first through hole.

Semiconductor module

A resin molding includes a semiconductor element, a circuit board, and a resin. A conductor connected to the semiconductor element is formed on the circuit board. The resin is adhered and integrated with the circuit board. A resin leakage suppression layer including a material having a higher thermal conductivity than that of a material forming a surface layer of the circuit board is provided in an edge region extending along a portion adhered to the resin in the circuit board and extending along at least one-side side surface of the resin.

Resin molding and sensor device

In a module in which a circuit board is integrally insert molded with a housing while semiconductor parts mounted on the circuit board are exposed, deformation of the circuit board caused by pressure on the circuit board by a mold for blocking the molding resin is reduced. In the module in which the circuit board is integrally insert molded with the housing while the semiconductor parts mounted on the circuit board are exposed, the deformation of the circuit board is reduced by placing a material, which has an elastic modulus smaller than the elastic modulus of the printed circuit board, in the projection area of the mold holding portion on the circuit board.

Sensor including a printed circuit board with semiconductor parts having a first and second resin

In order to provide a method of manufacturing a thermal type flowmeter that is capable of reducing deformation of a semiconductor chip, which is caused by molding, a method of manufacturing a thermal type flowmeter is provided that includes a circuit package of a resin-molded semiconductor chip. The method includes resin-molding the semiconductor chip in a state in which a mold is pressed against a heat transfer surface that is provided on a surface of the semiconductor chip and a pressed surface that is set on the surface of the semiconductor chip at a position separate from the heat transfer surface.

Thermal type flowmeter

An objective of the present invention is, in a thermal flow meter having a structure including a resin portion formed in the vicinity of a diaphragm structural portion using a mold, to prevent destruction of the diaphragm structural portion at the time of pressing the mold, in a method of manufacturing the thermal flow meter, including: supporting a gas flow measurement elementon support membersand, the gas flow measurement elementincluding a cavity portionsurrounded by a substrate inclined portioninclined to a substrate surface, a diaphragmthat covers the cavity portion, and an electrical resistive element formed in the diaphragm; and covering the gas flow measurement elementand the support membersandwith the resin portionformed with the mold, to set the moldsuch that an acting portion of pressure force by the mold that molds the resin portionis positioned outside the substrate inclined portionin the entire periphery of the diaphragm

Method of manufacturing thermal flow meter

An excellent drug for treating or preventing cardiovascular diseases, based on cGMP production enhancing action due to soluble guanylate cyclase activating action, is provided. It was found that imidazopyridine compounds having a carbamoyl group at the 3-position and a substituent bonded at the 8-position via an oxygen atom in an imidazo[1,2-a]pyridine skeleton exhibits a cGMP production enhancing action by a potent soluble guanylate cyclase activating action, and is useful as a drug for treating or preventing various soluble guanylate cyclase-related cardiovascular diseases, thereby completing the present invention.

Imidazopyridine compounds

[Problem] A pharmaceutical composition for treating or preventing various cardiovascular diseases, which have sGC activities based on improvement of cGMP signals, is provided. [Means for Solution] It was found that imidazo[1,2-a]pyridine compounds having a carbamoyl group at the 3-position and a particular cyclic group at the 8-position via a methyleneoxy group, or a salt thereof have sGC activation, and are useful as active ingredients of pharmaceutical compositions for treating or preventing various sGC-related cardiovascular diseases, in particular, peripheral arterial diseases, intermittent claudication, critical limb ischemia, hypertension, and pulmonary hypertension, thereby completing the present invention.

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Tokyo, Japan

Tsubasa Watanabe