Applied Materials, Inc.

Tsu-Hui Yang

Ching-Chang Chen

Hsiu-Jen Wang

Shih-Hao Kuo

Chien-Hua Lai

Chia-Hung Kao

Yi-Sheng Liu

Rudolf C Brunner

Nimrod Smith

Preston Fung

Shih-Hsien Lee

Davidi Kalir

Vasuman Ghanapaati Srirangarajan

Assaf Kidron

Liang-yu Chen

Jiawei Shi

Che-Kai Chang

Grant Wang

Embodiments of the present disclosure relate to projection stabilization systems and maskless lithography systems having projection stabilization systems. The projection stabilization system compensates for propagating vibrations that move image projection systems (IPS's). The IPS's are in a processing position prior to operation of the maskless lithography process. One or more stiffeners are coupled to the IPS. The one or more stiffeners apply pressure to flexures coupled to each stiffener. The flexures are coupled to the IPS to provide stabilization to the IPS during the operations of the maskless lithography process. For example, the one or more of stiffeners protect the IPS from vibrations that propagate through the system during operation.

Pneumatic controlled flexure system for stabilizing a projection device

Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.

Multi-substrate processing on digital lithography systems

Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.

Multi-configuration digital lithography system

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Dongkung Town, Taiwan

Tsu-Hui Yang