Growing community of inventors

Sunnyvale, CA, United States of America

Tsongming Kao

Average Co-Inventor Count = 4.47

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 6

Tsongming KaoKostadin Dimitrov Djordjev (4 patents)Tsongming KaoHrishikesh Vijaykumar Panchawagh (3 patents)Tsongming KaoYipeng Lu (3 patents)Tsongming KaoNicholas Ian Buchan (3 patents)Tsongming KaoChin-Jen Tseng (3 patents)Tsongming KaoJae Hyeong Seo (2 patents)Tsongming KaoCharles Chengyea Leu (1 patent)Tsongming KaoSuryaprakash Ganti (1 patent)Tsongming KaoDavid William Burns (1 patent)Tsongming KaoJessica Liu Strohmann (1 patent)Tsongming KaoFiras Sammoura (1 patent)Tsongming KaoLeonard Eugene Fennell (1 patent)Tsongming KaoRihui He (1 patent)Tsongming KaoIla Ravindra Badge (1 patent)Tsongming KaoTsongming Kao (5 patents)Kostadin Dimitrov DjordjevKostadin Dimitrov Djordjev (63 patents)Hrishikesh Vijaykumar PanchawaghHrishikesh Vijaykumar Panchawagh (95 patents)Yipeng LuYipeng Lu (36 patents)Nicholas Ian BuchanNicholas Ian Buchan (27 patents)Chin-Jen TsengChin-Jen Tseng (13 patents)Jae Hyeong SeoJae Hyeong Seo (9 patents)Charles Chengyea LeuCharles Chengyea Leu (92 patents)Suryaprakash GantiSuryaprakash Ganti (84 patents)David William BurnsDavid William Burns (58 patents)Jessica Liu StrohmannJessica Liu Strohmann (38 patents)Firas SammouraFiras Sammoura (21 patents)Leonard Eugene FennellLeonard Eugene Fennell (10 patents)Rihui HeRihui He (4 patents)Ila Ravindra BadgeIla Ravindra Badge (3 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Qualcomm Incorporated (3 from 41,326 patents)

2. Qualcomm Mems Technologies, Inc. (2 from 577 patents)


5 patents:

1. 12327426 - Ultrasonic fingerprint sensor for under-display applications

2. 11126814 - Ultrasonic fingerprint sensor with flexible substrate

3. 10929636 - Ultrasonic fingerprint sensor with electrically nonconductive acoustic layer

4. 9156678 - MEMS encapsulation by multilayer film lamination

5. 8803861 - Electromechanical systems device

Please report any incorrect information to support@idiyas.com
idiyas.com
as of
12/4/2025
Loading…