Taiwan Semiconductor Manufacturing Comp. Ltd.

Tsong-Mu Lai

Hua-Shu Ivan Wu

Ming-Chih Chang

A method for fabricating micro pipes on a semiconductor wafer or other substrate. According to the method of the invention, a base layer is initially deposited on the substrate and then etched to form a trench which exposes the surface of the substrate. Next, a PR (photoresist) layer of selected thickness is deposited over the base layer and the trench. Finally, in a curing step, the deposited photoresist is irradiated with ionizing radiation to cause outgassing of nitrogen gas from the photoresist layer, between the PR layer and the substrate. This step facilitates buckling of the PR layer into an arcuate bubble which defines the semispherical micro pipe structure.

Micro pipe manufacturing method

A method for producing a spheroidal shaped micro-array assembly including providing a substrate having frontside patterned openings formed in the substrate; blanket depositing a photosensitive layer over the substrate including the frontside patterned openings; exposing the photosensitive layer to ionizing radiation for a predetermined period of time to produce outgassing to separate the photosensitive layer and substrate to produce a spheroidal shaped photosensitive layer portion; blanket depositing a mirror layer over the photoresist layer to preserve the spheroidal shaped photosensitive layer portion; and removing the photosensitive layer.

Growing community of inventors

Thubei, Taiwan

Tsong-Mu Lai