Powertech Technology Inc.

Tseng-Shin Chiu

Chao-Hsiang Leu

Chia-Yu Hung

Chuang-Fa Lee

A window-type semiconductor package is disclosed to avoid peeling at the moldflow entrance, primarily comprising a substrate, a chip with the active surface attached to the substrate, a die-attaching layer bonding the active surface of the chip to a substrate core of the substrate, a plurality of bonding wires, and an encapsulant. The substrate core has a slot. One end of the slot outside the chip is formed as a moldflow entrance with two or more moldflow blocking lumps protrusively disposed on the substrate core and located at the intersections between one edge of the chip and the two opposing sides of the slot adjacent to the moldflow entrance. Accordingly, the moldflow pressures exerting at the die-attaching layer are blocked to avoid the peeling of the die-attaching layer at the moldflow entrance and to keep a constant die-attaching gap.

Window-type semiconductor package to avoid peeling at moldflow entrance

A multi-chip IC package encapsulates a chip under asymmetric longer single-side leads. The package mainly comprises a plurality of leads that have asymmetric length at two sides of a leadframe, a plurality of die-attach tape strips, a first chip having a plurality of single-side pads under the longer side leads, at least a second chip disposed above the longer side leads, a plurality of bonding wires and a molding compound. The die-attach tape strips are mutually parallel and adhered onto the lower surfaces of the longer side leads to adhere the first chip. There is at least a mold-flow channel formed through the first chip, the longer side leads and the die-attach tape strips. The bonding wires electrically connect the single-side pads of the first chip to the leads at the two sides of the leadframe through a non-central gap. The molding compound encapsulates the first chip, the second chip, the bonding wires and portions of the leads at the two sides of the leadframe and fills up the mold-flow channel. The mold-flow channel formed by means of the die-attach tape strips may increase the encapsulated area of the first chip by the molding compound to enhance product reliability of semiconductor package.

Growing community of inventors

Hsinchu, Taiwan

Tseng-Shin Chiu