Nan Ya Technology Corporation

Nanya Technology Corporatiion

Tse-Yao Huang

Yi-Nan Chen

Shing-Yih Shih

Hsien-Wen Liu

Yu-Chi Sun

Tzu-Ching Tsai

Hui-Min Mao

Chih-Ching Lin

Hsih-Yang Chiu

Ming-Cheng Chang

Kuo-Chien Wu

Chung-Peng Hao

Jin-Tau Huang

Chiang-Lin Shih

Jeng-Ping Lin

Yinan Chen

Mao-Ying Wang

Wen-Chieh Wang

Chao-Wen Lay

Chang Rong Wu

Hsiu-Chun Lee

Wei-Hui Hsu

Change-Rong Wu

Bing-Hung Chen

A semiconductor device structure includes a first dielectric layer disposed over a semiconductor substrate, and a second dielectric layer disposed over the first dielectric layer. The semiconductor device structure also includes a spacer structure disposed in the second dielectric layer, and a conductive structure penetrating through the second dielectric layer and extending into the first dielectric layer. The conductive structure is surrounded by the spacer structure. The semiconductor device structure further includes a liner layer separating the conductive structure from the first dielectric layer, the second dielectric layer and the spacer structure. The liner layer has a tapered sidewall in direct contact with the first dielectric layer.

Semiconductor device structure with liner layer having tapered sidewall and method for preparing the same

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate including an array area and a peripheral area; and a peripheral gate structure including: a peripheral gate dielectric layer inwardly positioned in the peripheral area of the substrate and including a U-shaped cross-sectional profile; a peripheral gate conductor including a bottom portion positioned on the peripheral gate dielectric layer and a neck portion positioned on the bottom portion; and a peripheral gate capping layer positioned on the peripheral gate dielectric layer and the bottom portion, and surrounding the neck portion. A top surface of the peripheral gate capping layer and a top surface of the neck portion are substantially coplanar.

Semiconductor device with peripheral gate structure and method for fabricating the same

The present application discloses a semiconductor device with adjustment layers and a method for fabricating the semiconductor device with the adjustment layers. The semiconductor device includes a substrate, an interconnection structure positioned on the substrate, a contact positioned penetrating the interconnection structure, two adjustment layers positioned on sidewalls of the contact, a contact barrier layer positioned between the interconnection structure and the contact and between the substrate and the contact, wherein the two adjustment layers are positioned between the contact and the contact barrier layer. A bottom segment of the contact barrier layer is positioned between the substrate and the contact, and bottom most points of the two adjustment layers contact the bottom portion of the contact barrier layer.

Semiconductor device with adjustment layers and method for fabricating the same

The present application discloses a semiconductor device. The semiconductor device includes a substrate; a peripheral gate structure including: a peripheral gate insulating layer inwardly positioned in the substrate and including a U-shaped cross-sectional profile, a peripheral work function layer positioned on the peripheral gate insulating layer and including a recess, a first peripheral interconnect layer positioned on the peripheral work function layer, a first peripheral liner layer positioned between the peripheral work function layer and the first peripheral interconnect layer, and a peripheral capping layer positioned on the first peripheral interconnect layer. The peripheral work function layer includes titanium, titanium nitride, silicon, silicon germanium, or a combination thereof. The first peripheral liner layer includes graphene. The first peripheral interconnect layer includes tungsten, tungsten nitride, or a combination thereof.

Semiconductor device with work function layer

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a plurality of first conductive structures positioned on the substrate; a plurality of outer liner layer each positioned on a corresponding sidewall of the plurality of first conductive structures; and a plurality of bottom inter-feature dielectric layers positioned on the plurality of outer liner layers and between the plurality of first conductive structures. Each of the outer liner layers includes one or more species of vanadium oxide. The plurality of bottom inter-feature dielectric layers are porous.

Semiconductor device with porous dielectric layers and method for fabricating the same

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a word line structure positioned in the substrate; a plurality of impurity regions positioned in the substrate and adjacent to the word line structure; a plurality of bottom shallow contacts positioned on the word line structure; a first interconnect layer positioned on the plurality of bottom shallow contacts; a plurality of top shallow contacts positioned on the first interconnect layer; and a plurality of deep contacts positioned on the plurality of impurity regions. Top surfaces of the plurality of top shallow contacts and top surfaces of the plurality of deep contacts are substantially coplanar.

Semiconductor device with shallow contacts and method for fabricating the same

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a first tier structure positioned on a substrate and including: a plurality of conductive features of the first tier structure positioned over the substrate, and a decoupling unit of the first tier structure positioned between the plurality of conductive features of the first tier structure, and including a bottle-shaped cross-sectional profile; a first set of solid alignment marks including: a first-tier-alignment mark of the first set of solid alignment marks positioned on the decoupling unit of the first tier structure; a first set of spaced alignment marks including: a first-tier-alignment mark of the first set of spaced alignment marks positioned in a mirror manner of the first-tier-alignment mark of the first set of solid alignment marks according to a first axis of symmetry.

Semiconductor device with an insulative decoupling unit positioned between two of a plurality of conductive features

The present application discloses a contact structure, a semiconductor device, and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; an impurity region positioned in the substrate; an intervening conductive layer positioned on the impurity region; a bottom conductive layer positioned on the bottom conductive layer; a conductive capping layer positioned on the bottom conductive layer; a top conductive layer positioned on the conductive capping layer. The intervening conductive layer, the bottom conductive layer, the conductive capping layer, and the top conductive layer configure a contact structure. The bottom conductive layer includes germanium or silicon germanium. The bottom conductive layer includes n-type dopants or p-type dopants.

Semiconductor device with contact structure and method for fabricating the same

The present application provides a semiconductor structure having a porous structure between a conductive pad and a metal layer. The semiconductor structure includes: a substrate including an interconnection structure; a dielectric layer disposed over the substrate; a conductive pad disposed over the dielectric layer; a passivation layer, disposed over the dielectric layer and partially exposing the conductive pad; and a porous layer, surrounded by the dielectric layer and extending between the substrate and the conductive pad.

Semiconductor structure with a porous structure

The present application discloses a method for fabricating a semiconductor device. The method includes: providing a substrate; forming an impurity region in the substrate; forming a first dielectric layer on the substrate; forming an opening along the first dielectric layer to expose the impurity region; conformally forming a layer of first material in the opening; forming a layer of filler material on the layer of first material to completely fill the opening; and performing a planarization process until the top surface of the first dielectric layer is exposed to turn the layer of first material into an intervening film and the layer of filler material into a filler layer. The intervening film includes a U-shaped cross-sectional profile and silicon carbide.

Method for fabricating semiconductor device with liner structure

The present disclosure provide a semiconductor device and a method for preparing the semiconductor device. The semiconductor device includes a first buried gate structure and a second buried gate structure disposed in a semiconductor substrate. The first buried gate structure includes a first gate dielectric layer, and a first lower semiconductor layer disposed over the first gate dielectric layer. The first lower semiconductor layer has a T-shaped profile in a cross-sectional view. The first buried gate structure also includes a first upper semiconductor layer disposed over the first lower semiconductor layer. The second buried gate structure includes a second gate dielectric layer, and a second lower semiconductor layer disposed over the second gate dielectric layer. The second lower semiconductor layer has a U-shaped profile in the cross-sectional view. The second buried gate structure also includes a second upper semiconductor layer disposed over the second lower semiconductor layer.

Semiconductor device with buried gate structures and method for preparing the same

The present application discloses a semiconductor device. The semiconductor device includes a substrate; a first dielectric layer positioned on the substrate; a first conductive layer positioned in the first dielectric layer; an intervening film positioned on the first conductive layer and including a U-shaped cross-sectional profile; and a filler layer positioned on the intervening film. The intervening film includes silicon carbide.

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Taipei, Taiwan

Tse-Yao Huang