Taiwan Semiconductor Manufacturing Comp. Ltd.

Tsinghua University

Tse-Pan Yang

Jen-Yuan Chang

Wei Ju Lee

Hsin-Fei Meng

Sheng-Fu Horng

Jen-Chun Wang

Ming-Kun Lee

Kuo-Pei Lu

Tarng-Shiang Hu

A test key configured to measure resistance of a through semiconductor via in a semiconductor substrate is provided. The test key includes a first resistor, a first conductor, a first probe pad, a second conductor, a second probe pad, a third conductor, a third probe pad, a fourth conductor, and a fourth probe pad. The first probe pad is electrically connected to a first end of the through semiconductor via by the first resistor and the first conductor. The second probe pad is electrically connected to the first end of the through semiconductor via by the second conductor. The third probe pad is electrically connected to a second end of the through semiconductor via by the third conductor. The fourth probe pad is electrically connected to the second end of the through semiconductor via by the fourth conductor.

Test key and semiconductor die including the same

The present invention provides a microwave annealing method for a plastic substrate. The method comprises pulsed microwave annealing to an organic photo-voltaic device to avoid warpage and degradation of the plastic substrate. Utilizing pulsed microwave annealing method can improve the wettability of the organic layer on the plastic substrate verified by contact angle measurement, and achieving the organic solar cell fabricated with higher power conversion efficiency.

Microwave annealing method for device processing with plastic substrate

Growing community of inventors

Hsinchu, Taiwan

Tse-Pan Yang