Innolux Corporation

Chimei Innolux Corporation

Innolux Display Corporation

Chimel Innolux Corporation

Advanced Optoelectronic Technology, Inc.

Innocom Technology(shenzhen) Co., Ltd.

Tsau-Hua Hsieh

Chun-Hsien Lin

Tung-Kai Liu

Shu-Ming Kuo

Tzu-Min Yan

Hui-Chieh Wang

Wan-Ling Huang

Jian-Jung Shih

Fang-Ying Lin

Kai Cheng

Shang-Yu Huang

Shun-Yuan Hu

Charles Chien

Jia-Pang Pang

Jui-Feng Ko

Yi-An Chen

Chih-Yung Hsieh

Ming-Chang Lin

Chao-Liang Lu

Hung-Yu Chen

Chao-Yi Hung

Hung-Sheng Cho

Ming-I Chao

Bo-Feng Chen

Kuan-Feng Lee

Chiu-Lien Yang

Kuan-Hung Kuo

Hsin-Li Chen

Jian-Jhong Fu

Hao-Ching Chien

Chandra Lius

Li-Wei Mao

Hirofumi Watsuda

Wei-Cheng Chu

Ting-Kai Hung

Geng-Fu Chang

Chih-Hao Chen

Chien-Ting Lai

Shuo-Ting Yan

Jen-Chieh Peng

Chih-Wei Ho

Cheuh-Ju Chen

Chin-Lung Ting

Po-Min Tu

Shih-Cheng Huang

Tzu-Chien Hung

Chueh-Ju Chen

Sz-Hsiao Chen

Chien-Chung Peng

Kuo-Chang Chiang

Tzu-Yuan Lin

Chao-Chih Lai

Chia-Hsiu Hsu

Yu-Hsin Liu

Hsiao-Ping Lai

Jui-Jen Yueh

Chia-Hao Tsai

Chien-Hsueh Chiang

Chien-Shiang Huang

Eddy Giing-Lii Chen

Sheng-Tien Cho

Chih-Sheng Chang

Kuan-Yi Yang

Chang-Ho Chen

Chih-Chieh Hsu

Yu-Lin Hsieh

Hung-Yu Chien

Yu-Cheng Tsai

Jen-Chien Peng

Paul-John Schuele

Jong-Jan Lee

The present disclosure discloses an electronic device which includes an electronic panel and a supporting plate. The electronic panel includes a substrate, an electronic component disposed on the first surface of the substrate, and a circuit board disposed on the second surface of the substrate. The first surface is opposite to the second surface, and the electronic component and the circuit board are electrically connected to each other. The supporting plate is arranged under the electronic panel and includes an opening through which the circuit board passes. The difference of the thermal expansion coefficient between the substrate and the supporting plate is less than or equal to 4 ppm/° K.

Electronic device

An electronic device including a first substrate body, a plurality of light-emitting diodes, a second substrate body, a first polymer element, and a second polymer element is provided. The first substrate body has a light-emitting region and a non-light-emitting region adjacent to the light-emitting region. The plurality of light-emitting diodes are disposed on the first substrate body. The second substrate body is disposed opposite to the first substrate body. The first polymer element is disposed between the plurality of light-emitting diodes and the second substrate body, and disposed in the light-emitting region. The second polymer element is disposed between the first substrate body and the second substrate body, and disposed in the non-light-emitting region. There is a distance between a top surface of the second polymer element and a bottom surface of the second substrate body, and the distance is greater than 0.

The disclosure discloses a method for manufacturing light-emitting diode (LED) chips. The manufacturing method includes: providing a plurality of LED elements; randomly mixing the plurality of LED elements; performing a mesa process on the plurality of LED elements; and forming at least one pair of electrodes on the plurality of LED elements. An electronic device includes the LED chips.

Electronic device and manufacturing method thereof

The disclosure provides a display panel and a tiled display device. The display panel has a tiling edge and includes a non-transparent part and a transparent part. The transparent part has a peripheral edge. At least a portion of the peripheral edge of the transparent part is overlapped with the tiling edge. The tiled display device includes a plurality of display panels tiled together by the tiling edges thereof.

Display panel and tiled display device

A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.

Method for manufacturing light emitting device

A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.

Method of manufacturing an electronic device

An electronic device includes a substrate, a spacer, a first element and a second element. The spacer is disposed on the substrate and has a first portion, a second portion, a first opening, a second opening and a third opening arranged in a first direction. In a cross-section view, the second opening is located between the first opening and the third opening, the first portion is located between the first opening and the second opening, and the second portion is located between the second opening and the third opening. A width of the first portion is less than a width of the second portion in the first direction, and an area of the second opening is different from an area of the first opening. The first element is overlapped with the first opening. The second element is overlapped with the third opening.

An electronic device includes a first substrate, a circuit layer, a conductive wire, and an adhesive layer. The first substrate has a first surface, a second surface and a first side surface. The second surface is opposite to the first surface, the first side surface is located between the first surface and the second surface, and the first side surface connects the first surface and the second surface. The circuit layer is disposed on the first surface of the first substrate. The conductive wire is electrically connected to the circuit layer. The adhesive layer is disposed on the first surface and the circuit layer. The adhesive layer has a second side surface, and a first portion of the conductive wire is disposed on the first side surface of the first substrate and the second side surface of the adhesive layer.

A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

Tiling electronic device and manufacturing method thereof

An electronic device is provided. The electronic device includes a substrate and another substrate disposed opposite to the substrate. The electronic device includes a first light-emitting element disposed on the substrate and configured to emit blue light under a first current density when the substrate provides a first current to the first light-emitting element. The electronic device includes a second light-emitting element disposed on the substrate and configured to emit green light or red light under a second current density when the substrate provides a second current to the second light-emitting element. The electronic device includes a protective layer disposed between the substrate and the another substrate and covering the first light-emitting element and the second light-emitting element. The electronic device includes an adhesive layer disposed between the protective layer and the another substrate.

The display device includes a first substrate, a second substrate, a red filter layer, a green filter layer, a blue filter layer, a first light emitting diode and a second light emitting diode. The red filter layer, the green filter layer and the blue filter layer are disposed between the first substrate and the second substrate. A portion of the red filter layer, a portion of the green filter layer and a portion of the blue filter layer are stacked with each other to form a light blocking structure. The first light emitting diode and the second light emitting diode are disposed between the first substrate and the second substrate and adjacent to each other. An orthographic projection of the light blocking structure on the second substrate is located between orthographic projections of the first light emitting diode and the second light emitting diode on the second substrate.

Display device

The present disclosure provides a transferring head and a method for manufacturing an electronic device. The transferring head includes a substrate, a head unit, and a plurality of connecting elements. The head unit includes an electrode and a cantilever supporting the electrode. Two adjacent ones of the connecting elements are disposed between the substrate and the head unit. The electrode and a part of the cantilever are suspended over the substrate, and the cantilever is connected between one of the plurality of connecting elements and the electrode. The electrode is spaced apart from the plurality of connecting elements when viewed along a normal direction of the substrate.

Transferring head and method for manufacturing electronic device

The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting diodes, a second substrate, a transparent material layer, and a sealing material. The first substrate comprises a first substrate body. The plurality of light-emitting diodes are disposed on the first substrate body. The second substrate is disposed opposite to the first substrate, and comprises a second substrate body. The transparent material layer is disposed between the first substrate and the second substrate. The sealing material is disposed between the first substrate and the second substrate and surrounds the transparent material layer. A distance between a bottom surface of the sealing material and a top surface of the first substrate body is less than a distance between a top surface of the sealing material and a bottom surface of the second substrate body.

Electronic device and method of manufacturing electronic device

A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.

Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process:

Methods for manufacturing a display device

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Miao-Li County, Taiwan

Tsau-Hua Hsieh