Youngtek Electronics Corporation

Tsan-Hsiung Lai

Kuei-Pao Chen

Ping-Lung Wang

Yang-Chieh Chen

Guang-Chen Chen

Wei-Liang Chou

A method for transferring objects and a transfer apparatus using the same are provided. The method includes the following steps: controlling, during a first period, the ejector at an ejecting working position to perform an ejecting process along with a first direction, to transfer the object from the first substrate to the second substrate; controlling, during a second period, the ejector to move to an ejecting standby position along with a second direction which is non-parallel to the first direction, to expose at least one of the object on the first substrate to a detection range of an image capturing device; detecting the position of the object in the detection range to obtain calibration information; and adjusting the position of the first substrate according to the calibration information.

Method for transferring objects and transfer apparatus using the same

A method of integration testing for packaged electronic components is capable of improving a conventional testing for packaged electronic components. In this method, non-tested sides of the packaged electronic components are stuck with a downward exposure onto a testing carrier board so that conductive pins are oriented to test spaces to test the plurality of packaged electronic components stuck onto the testing carrier board according to testing steps for convenient classification packaging, advanced testing efficiency, economical working hours and costs. Programmable features and man-hour saving are provided for easy mass production and testing.

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Hsinchu, Taiwan

Tsan-Hsiung Lai