Taiwan Semiconductor Manufacturing Comp. Ltd.

Tsai-Tsung Tsai

Chung-Shi Liu

Ming-Da Cheng

Chen-Hua Douglas Yu

Chih-Wei Lin

Hui-Min Huang

Wei-Hung Lin

Kuei-Wei Huang

Ai-Tee Ang

Meng-Tse Chen

Chih-Fan Huang

Mirng-Ji Lii

Chien Ling Hwang

Yeong-Jyh Lin

Yi-Li Hsiao

Ching-Hua Hsieh

Wen-Hsiung Lu

Cheng-Chung Lin

Yu-Peng Tsai

Yi-Da Tsai

Chia-Min Lin

Sheng-Chieh Yang

A first protective layer is formed on a first die and a second die, and openings are formed within the first protective layer. The first die and the second die are encapsulated such that the encapsulant is thicker than the first die and the second die, and vias are formed within the openings. A redistribution layer can also be formed to extend over the encapsulant, and the first die may be separated from the second die.

Semiconductor package system and method

A semiconductor device includes a first package component and a second package component. The first package component has a first die formed on a first substrate. A second package component has a second die formed on a second substrate. A thermal isolation material is attached on the first die, wherein the thermal isolation material thermally insulates the second die from the first die, and the thermal isolation material has a thermal conductivity of from about 0.024 W/mK to about 0.2 W/mK. A first set of conductive elements couples the first package component to the second package component.

Package-on-package structure including a thermal isolation material

A semiconductor package including a semiconductor die, a molding compound and a redistribution structure is provided. The molding compound laterally wraps around the semiconductor die, wherein the molding compound includes a base material and a first filler particle and a second filler particle embedded in the base material. The first filler particle has a first recess located in a top surface of the first filler particle, and the second filler particle has at least one hollow void therein. The redistribution structure is disposed on the semiconductor die and the molding compound, wherein the redistribution structure has a polymer dielectric layer. The polymer dielectric layer includes a body portion and a first protruding portion protruding from the body portion, wherein the body portion is in contact with the base material and the top surface of the first filler particle, and the first protruding portion fits with the first recess of the first filler particle.

Semiconductor package and method of forming the same

According to an exemplary embodiment, a semiconductor package is provided. The semiconductor package includes at least one chip, and at least one component adjacent to the at least one chip, wherein the at least one chip and the at least one component are molded in a same molding body.

Semiconductor package, semiconductor device and method of forming the same

Package on-package structure including a thermal isolation material and method of forming the same

An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.

Methods for stud bump formation

According to an exemplary embodiment, a semiconductor package is provided. The A semiconductor package includes at least one chip, and at least one component adjacent to the at least one chip, wherein the at least one chip and the at least one component are molded in a same molding body.

Package-on-package structure including a thermal isolation material and method of forming the same

A method of manufacturing a semiconductor device includes providing a wafer, grinding a backside of the wafer, disposing a backside film on the backside of the wafer, cutting the wafer to singulate a plurality of dies from the wafer, and forming a mark on the backside film disposed on each of the plurality of dies by a laser operation.

Method of manufacturing a semiconductor device

Growing community of inventors

Taoyuan, Taiwan

Tsai-Tsung Tsai