Au Optronics Corporation

Tsai-Chi Yeh

Chih-Hao Wang

Chih-Hung Chen

Chih-Chun Chen

Yu-Ting Liu

Kuan-Ting Chen

Wen-Hui Peng

Po-Fu Huang

Wei-Fu Wu

Shang-Lin Chiang

Ming-Huei Lin

Pei-Chi Hsu

Ting-Shiun Huang

Ting-Wei Chung

Sheng-Yun Hsu

Yu Tseng

Chih-Cheng Kao

A display device includes a pixel array substrate and a circuit board. The pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. Multiple bonding pads are located on the first surface. The circuit board is bent from above the first surface of the pixel array substrate to below the second surface. The circuit board is electrically connected to the bonding pads and includes a thermoplastic substrate. The thermoplastic substrate includes a third surface facing the pixel array substrate and a fourth surface opposite to the third surface. The thermoplastic substrate includes a first bend formed by thermoplastics.

Display device and manufacturing method thereof

An electronic device includes a substrate, first signal lines, pixel structures, first pads, transmission pads, a first combination circuit board, and a transmission circuit board. The first pads are electrically connected to some of a plurality of first signal lines. The transmission pads are electrically connected to some of the first signal lines. The first combination circuit board is disposed between a first side and a second side of the substrate opposite to each other. The transmission circuit board is disposed between the first combination circuit board and the second side of the substrate. The first combination circuit board is electrically connected to at least some of the first pads, and a first pitch exists between the adjacent first pads. The transmission pads are electrically connected to the transmission circuit board, and a transmission-pad pitch exists between the adjacent transmission pads. The transmission-pad pitch is greater than the first pitch.

Electronic device

A circuit substrate includes a substrate, a first lead line, a second lead line, an insulating layer and a pad. The substrate has a pad region, a first non-pad region and a second non-pad region. The first lead line extends from the first non-pad region to the pad region. The second lead line extends from the second non-pad region to the pad region. The insulating layer is interposed between the first and second lead lines. The pads are on the pad region of the substrate and one of the pads is electrically connected to the first and second lead lines. A display panel including the circuit substrate is also provided.

Circuit substrate and display panel including the same

A pixel array substrate includes a substrate having a display region and a non-display region, a pixel array in the display region, first and second lead lines, first pads in the non-display region, second pads in the non-display region and on a first insulating layer, and the first insulating layer. The first lead lines electrically connect the pixel array and extend from the display region to the non-display region. Each first pad electrically connects one corresponding first lead line. The first insulating layer covers the first lead lines and exposes the first pads. The second lead lines on the first insulating layer electrically connect the pixel array and extend from the display region to the non-display region. Each second pad electrically connects one corresponding second lead line. A distance between each first pad and the adjacent second pad along a horizontal direction is 10 um&#x2dc;20 um.

Pixel array substrate, conductive structure and display panel

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Yunlin County, Taiwan

Tsai-Chi Yeh