Delta Design, Inc.

Troy Taylor

Tom F Jones

Steve Wetzel

Michael Callaway

A semiconductor device test assembly includes a heat sink having a surface configured to support a device under test, an inner bellow, an outer bellow at least partially surrounding the inner bellow, and a fluid channel within the inner bellow for providing a fluid to the heat sink. The semiconductor device test assembly can further include an air adjustment unit for adjusting an air pressure in the outer bellow, so as to adjust a contact force between the heat sink and the device under test.

Apparatus and method for controlling die force in a semiconductor device testing assembly

A method for soaking a device in an automated testing system, includes setting a temperature control device to a first temperature, exposing the device to the temperature control device, and driving the temperature control device to a second temperature. The temperature transition rate from the first temperature to the second temperature is derived from a first natural decay rate. The first natural decay rate is based on a first-order thermal response of the device when the device is suspended in free air. The second temperature of the temperature control device is relative to a set point temperature so that when the device is socketed for testing, the temperature of the device settles at the set point temperature.

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Poway, CA, United States of America

Troy Taylor