Rudolph Technologies, Inc.

Troy Palm

Kevin Barr

Matthew M Laberge

Ralph P Sowden

Chetan Suresh

Brian Delsey

Andrey Monjoseph

Emily Nordick

Richard Sobotka

Isao Sato

Hiroki Ueno

Yasutoshi Ito

James H Greer

Masataka Ryu

Dennis Benson

A method and apparatus for detecting and handling deformed substrates, thus allowing them to be processed, and for increasing device yield on the substrate is herein disclosed. A sensor detects deformity, then the substrate is flattened, allowing a support to hold it securely.

Method and apparatus to assist the processing of deformed substrates

A mechanism for handling substrates such as semiconductor wafers is disclosed. The mechanism supports the substrate in a tilted orientation to ensure that undesirable contact between a bowed substrate and the mechanism does not occur. The structure that supports the substrate in a tilted orientation may be fixed or adjustable. A sensor may be provided to measure and/or monitor a distance between a substrate and the mechanism. Alternatively, a sensor for determining contact between the substrate and the mechanism may be provided.

Edge grip substrate handler

A loadport for handling film frames is disclosed. The loadport is modular and substantially compatible with applicable standards regarding modular equipment. In particular, the load port is substantially interchangeable with loadports not adapted for handling film frames. The loadport has a compact shuttle for moving film frames and flexible alignment mechanisms for aligning film frames and cassettes of different configurations.

Substrate handler

A BOLTS compatible module includes a support mechanism for gripping a wafer. The support mechanism is coupled to a rotary mechanism for rotating the support mechanism with a wafer grip therein. The rotary mechanism is coupled to the module and capable of at least 180&#xb0; of rotation.

Wafer inversion mechanism

A moveable semiconductor substrate support includes a control device receiving data from one or more sensors and providing control signals to one or more actuators. The control device is coupled to and moves with the moveable substrate support to facilitate flexible and complex operation of the substrate support itself.

Support for semiconductor substrate

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Eden Prairie, MN, United States of America

Troy Palm