Freescale Semiconductor,inc.

Motorola Corporation

Troy L Cooper

Prashant U Kenkare

Andrew Christopher Russell

Ravindraraj Ramaraju

Shayan Zhang

David R Bearden

William C Moyer

Perry H Pelley

James David Burnett

Michael A Mendicino

Michael D Snyder

James W Miller

George P Hoekstra

Bradford Lawrence Hunter

Jack M Higman

Huy Nguyen

David Burnett

Cynthia Ann Torres

David P Burgess

Eric V Fiene

Ravindraj Ramaraju

A storage unit on an integrated circuit stores information that identifies a circuit on the integrated circuit, a selected operating condition, and a required operating configuration for the circuit for the selected operating condition. The manner of operating the circuit is changed to the required operating configuration in response to an operating condition of the circuit changing to the selected operating condition. This allows for efficiently identifying the few circuits that do not meet specified requirements based on a reduction in, for example, operating voltage, and altering their operation in order to meet the specified requirements relative to the reduced operating voltage without having to do so for the vast majority of the circuits that are able to meet the requirements at the lowered operating voltage.

Integrated circuit having memory repair information storage and method therefor

A memory comprising memory cells wherein the memory is configured to operate in a normal voltage mode and a low voltage mode. The method includes during the normal voltage mode, operating the memory cells at a first voltage across each of the memory cells. The method further includes upon transitioning from the normal voltage mode to the low voltage mode, operating the memory cells at a second voltage across each of the memory cells, wherein the second voltage is lower than the first voltage. The method further includes performing an access on a subset of the memory cells while maintaining the second voltage across the memory cells.

Memory with low voltage mode operation

A processor includes a first virtual terminal, a second virtual terminal, circuitry coupled to the first virtual terminal for providing current to the first virtual terminal, a first regulating transistor coupled between the first virtual terminal and the second virtual terminal, a first disabling transistor coupled in parallel with the first regulating transistor for selectively disabling the first regulating transistor by directly connecting the second virtual terminal to the first virtual terminal, a second regulating transistor coupled between the second virtual terminal and a first power supply voltage terminal, and a second disabling transistor coupled in parallel with the second regulating transistor for selectively disabling the second regulating transistor by directly connecting the second virtual terminal to the first power supply voltage terminal.

Data processor having multiple low power modes

A memory system includes a memory array. The memory array includes a plurality of storage locations arranged in rows and columns. The memory system includes error correction circuitry that generates correct data bits from data bits of the memory array and error correction bits. The data bits received by the error correction circuitry are divided in subgroups where each subgroup of data bits is used to generate a subgroup of the correct data bits. The subgroups of data bits are stored in a row of the memory array at locations that are interleaved with each other.

Soft error correction in a memory array and method thereof

A memory and method for access the memory are provided. A first test is used to test memory elements to determine a lowest power supply voltage at which all the memory elements will operate to determine a weak memory element. Redundancy is used to substitute a redundant memory element for the weak memory element. The weak memory element is designated as a test element. In response to receiving a request to change a power supply voltage provided to the memory elements, a second test is used to test the test element to determine if the test element will function correctly at a new power supply voltage. If the test element passes the second test, the memory elements are accessed at the new power supply voltage. If the test element fails the second test, the memory elements are accessed using an access assist operation.

Integrated circuit memory having assisted access and method therefor

A clock signal is received at a clock node of a latch module, and a data signal is received at a data node of the latch module. The data signal including information to be latched at a first latch of the latch module and at a second latch of the latch module. A first representation of the data signal to a first data node of the first latch is delayed relative to a second representation of the data signal to a corresponding first data node of the second latch to obtain a first timing requirement between the data signal and the clock signal relative to the first latch that is substantially different than a second timing requirement. An error signal is generated in response to different data being latched at the first latch than at the second latch.

Soft error and transient error detection device and methods therefor

A method of writing data to a selected column of a memory includes selecting a first column. The data writing is initiated by applying a logic high to a first bit line of the first column and a first potential to a second bit line of the first column that is lower than the logic high. The first potential is removed and a second potential is applied to the second bit line. The second potential is less than the first potential. The first potential may be ground, and the second potential may be a negative voltage. Reducing the write voltage for the bit line that is receiving a logic low improves its ability to be written. By first bringing the logic low to the first potential, which may be ground, and then further reducing the applied voltage, the requirements on the source of the second potential are reduced.

Memory having negative voltage write assist circuit and method therefor

A storage element within a circuit design is identified. The storage element is replaced with both a first storage cell and a second storage cell. The second storage cell operates as a redundant storage cell to the first storage cell. An output of the first storage cell is connected to a first input of a comparator and an output of the second storage cell is connected to a second input of the comparator. The comparator provides an error indicator. Placement of the first storage cell, the second storage cell, the comparator, and one or more intervening cells is determined. The one or more intervening cells are placed between the first storage cell and the second storage cell. An integrated circuit is created using the comparator, the first storage cell, the second storage cell, the one or more intervening cells, and the determined placement.

Circuit and method for avoiding soft errors in storage devices

An integrated circuit comprises a global power supply conductor, a plurality of circuit blocks, a plurality of voltage converters, and control logic. The global power supply conductor is configured to distribute a supply voltage. The circuit blocks are selectively coupled to the global power supply conductor. The plurality of voltage converters are coupled to the global power supply conductor. An output voltage of individual voltage converters of the plurality of voltage converters are selectively coupled to one or more of the plurality of circuit blocks. The control logic is configured to control the selective coupling of at least one of the supply voltage and the output voltage of individual voltage converters of the plurality of voltage converters to corresponding ones of the plurality of circuit blocks. Also, the control logic controls a magnitude of the output voltage of individual voltage converters of the plurality of voltage converters.

Integrated circuit having boosted array voltage and method therefor

A memory includes an SRAM bitcell including a pair of cross-coupled inverters, wherein a first inverter of the pair includes a first device having a body and a second inverter of the pair includes a second device having a body. A first selection circuit has a first input coupled to a first supply voltage terminal, a second input coupled to a second supply voltage terminal, and an output coupled to a first current electrode of the first device and to a first current electrode of the second device. A second selection circuit has a first input coupled to the first supply voltage terminal, a second input coupled to the second supply voltage terminal, and an output coupled to the body of each of the first and second devices. A word line coupled to the SRAM bitcell is driven by a word line driver coupled to the first supply voltage terminal.

SRAM with read and write assist

A device is disclosed having a low-voltage memory device. The device includes a first memory having a first memory topology and a second memory having a second memory topology, with both memories located in an integrated circuit. The first memory is a relatively high-density memory device, capable of storing large amounts of data relative to the second memory. The second memory is a low-voltage memory device capable of being accessed at low-voltages relative to the voltage at which the first memory can be accessed. Accordingly, the second memory is accessible when the integrated circuit is placed in a low-voltage mode of operation, which may represent a data retention state (sleep state) for the first memory or other portions of the integrated circuit. Thus, the device is able to store large amounts of data in the high density memory in a normal or active mode of operation, and also have access to the low-voltage memory during the low-voltage mode of operation.

Low voltage memory device and method thereof

A multiple port memory has a word line driver that provides a word line signal to access a first write port of a multiple port memory cell in an array of multiple port memory cells during a write operation. A first logic circuit has a first input for receiving a first port selection signal, a second input for receiving a disable signal, and an output. A buffer circuit has an input coupled to the output of the first logic circuit, and an output for providing the word line signal. The disable signal is asserted to prevent the word line driver from accessing the first write port when a second write port of the multiple port memory cell is accessed during the write operation and the second write port has a higher priority than the first write port.

Multiple port memory with prioritized world line driver and method thereof

A semiconductor topography () is provided which includes a semiconductor-on-insulator (SOI) substrate having a conductive line () arranged within an insulating layer () of the SOI substrate. A method for forming an SOI substrate with such a configuration includes forming a first conductive line () within an insulating layer () arranged above a wafer substrate () and forming a silicon layer () upon surfaces of the first conductive line and the insulating layer. A further method is provided which includes the formation of a transistor gate () upon an SOI substrate having a conductive line () embedded therein and implanting dopants within the semiconductor topography to form source and drain regions () within an upper semiconductor layer () of the SOI substrate such that an underside of one of the source and drain regions is in contact with the conductive line.

Embedded substrate interconnect for underside contact to source and drain regions

An integrated circuit with a low voltage read/write operation is provided. The integrated circuit may include a processor and a plurality of memory cells organized in rows and columns and coupled to the processor, wherein a row of memory cells comprises a word line and all of the memory cells coupled to the word line, and wherein a column of memory cells comprises a bit line and all of the memory cells coupled to the bit line. The integrated circuit may further include a first power supply voltage terminal for receiving a first power supply voltage, wherein the first power supply voltage is provided to power the processor, and wherein the first power supply voltage is provided to power the plurality of memory cells during a first access operation of the plurality of memory cells. The integrated circuit may further include a second power supply voltage terminal for receiving a second power supply voltage higher than the first power supply voltage, wherein the second power supply voltage is provided to power the plurality of memory cells during a second access operation of the plurality of memory cells.

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Austin, TX, United States of America

Troy L Cooper