Robert Boschgmbh

Tristan Jobert

Markus Ulm

Florian Grabmaier

Uwe Hansen

Klaus Offterdinger

Hans-Peter Baer

Hans-Martin Irslinger

Thomas Klaus

Paul Hund

Christian Gerhardt

Michael Struchholz

Dirk Dittmann

A sensor device, having a flexible printed circuit board that has a fastening section for a chip structure, a chip structure situated on the fastening section of the flexible printed-circuit board, and a damper element for damping the chip structure from mechanical influences. The fastening section of the flexible printed circuit board, the chip structure and the damper element are situated one on top of the other.

Sensor having damping

A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.

Sensor device

A module, in particular a sensor module, has a module housing, a carrier element, a connection element, and at least one component, the module housing completely enclosing the at least one component and being situated on the carrier element, and the at least one component also being mounted on the connection element and being situated between the connection element and the carrier element.

Module and method for producing a module

Growing community of inventors

Reutlingen, Germany

Tristan Jobert