Intel Corporation

Triplicane Gopikrishnan Babu

Ritu Bawa

Prakash Kurma Raju

Prasanna Pichumani

Samarth Alva

Bijendra Singh

Kathiravan D

Raghavendra Doddi

Doddi Raghavendra

Sudheera Sudhakar

Bhavaneeswaran Anbalagan

Arunpandi R

Synthetic jet systems and related methods are disclosed. An electronic device includes a heat spreader including a first surface and a second surface opposite the first surface. A synthetic jet is coupled to the first surface of the heat spreader. The synthetic jet and the heat spreader define a fluid flow passageway having an inlet, a first outlet and a second outlet. The synthetic jet and the heat spreader to bifurcate airflow from the inlet such that the first outlet is to exhaust airflow from the passageway adjacent the first surface of the heat spreader and the second outlet is to exhaust airflow from the passageway adjacent the second surface of the heat spreader.

Thermal management systems for electronic devices and related methods

An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.

Hinge assembly and guide assembly for electronic devices using a heat carrying member

Growing community of inventors

Bengaluru, India

Triplicane Gopikrishnan Babu