Amazon Technologies, Inc.

Tri Nguyen

Hogan Lew

Srinivas S Chebrolu

Various apparatus are disclosed for lifting heat sinks during insertion of optical modules into transceiver cages (e.g., housings). The apparatus also provide for lifting of the heat sink during removal of the optical modules from the transceiver cages. While the heat sink is lifted during insertion or removal, the heat sink is in contact with the surface of the optical module when the optical module is fully inserted in the transceiver cage. Lifting of the heat sink during insertion and removal of the optical module allows a thermal interface material (TIM) to be placed on the surface of the heat sink in contact with the optical module to improve thermal conduction between the optical module and the heat sink.

Growing community of inventors

San Jose, CA, United States of America

Tri Nguyen