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Macdermid Acumen, Inc.

Macdermid, Incorporated

Trevor Pearson

Roderick Dennis Herdman

Roshan V Chapaneri

Craig Robinson

Terence Clarke

Alison Hyslop

Amrik Singh

Stacey Handy

Richard Tooth

Anthony Rowan

Ernest Long

Alan Gardner

Alan Peter Swales

Terrence Clark

Toshiyuki Yamamoto

Kotaro Ishiwata

Masahiro Hara

Marc Mertens

Tatsuya Nishiyama

Paul Bray

Maria Del Mar Cordero-Rando

Roderick Herdman

Roderick D Herdman

Anthony Wall

Anthony J Rowan

Roderick Dennis c/o Macdermid Plc Herdman

An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.

Electrolytic generation of manganese (III) ions in strong sulfuric acid

A method of treating a substrate, wherein the substrate comprises a layer deposited from a trivalent chromium electrolyte, is described. The method includes the steps of providing an anode and the chromium(III) plated substrate as a cathode in an electrolyte comprising (i) a trivalent chromium salt; and (ii) a complexant; and passing an electrical current between the anode and the cathode to passivate the chromium(III) plated substrate. The substrate may be first plated with a plated nickel layer so that the chromium(III) plated layer is deposited over the nickel plated layer.

Passivation of micro-discontinuous chromium deposited from a trivalent electrolyte

A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese(II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese(III) ions, wherein the manganese(III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.

Etching of plastic using acidic solutions containing trivalent manganese

An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.

Electrolytic generation of manganese (III) ions in strong sulfuric acid using an improved anode

A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non-conductive substrates for subsequent metallization steps.

Treatment for electroplating racks to avoid rack metallization

The invention consists of a chromium electroplating solution comprising a chromium electroplating solution comprising: (1) a water soluble trivalent chromium salt; (2) at least one complexant for trivalent chromium ions; (3) a source of hydrogen ions sufficient to create a pH of from 2.8-4.2; (4) a pH buffering compound; and (5) a sulfur-containing organic compound. The chromium electroplating solution is usable in a method for producing an adherent metallic coating on a decorative article, such coating having enhanced resistance to corrosion in environments containing calcium chloride.

Chromium alloy coating with enhanced resistance to corrosion in calcium chloride environments

An electrolytic cell and a method of electrochemical oxidation of manganese (II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.

A copper electroplating bath for producing copper electrodeposits is described. The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl, aryl or alkylaryl diamine. The copper electroplating bath can be used for producing electroformed copper deposits having low oxygen content.

Additives for producing copper electrodeposits having low oxygen content

An electrolytic cell for replenishing chromium content of a trivalent chromium electrolyte and a method of replenishing trivalent chromium content using the electrolytic cell is provided. The method comprising the steps of immersing a chromium electrode and a second electrode in a trivalent chromium electrolyte and applying an alternating pulse current across the chromium electrode and the second electrode. In this manner, trivalent chromium is electrolytically dissolved from the chromium electrode and the trivalent chromium content of the electrolyte in which the chromium electrode is immersed is enriched.

Electrolytic dissolution of chromium from chromium electrodes

An electroless nickel plating bath is provided that utilizes hypophosphite ions as a reducing agent and is substantially free of sulphate and sodium ions. Spent nickel in the plating bath is removed using an ion exchange resin and the remaining effluent solution is usable for manufacturing fertilizer compositions. The nickel is processed for inclusion back into the plating bath. Thus, the process of the invention allows for the indefinite use of the solutions without discharging hazardous waste.

Method of recycling electroless nickel waste

A plating process for plating chromium metal onto substrates is disclosed. The process uses a trivalent chromium plating bath with a sulfate and/or sulfonate matrix. The process also utilizes insoluble anodes. An addition of manganese ions to the plating bath inhibits the formation of detrimental hexavalent chromium ions upon use of the plating bath.

Process for plating chromium from a trivalent chromium plating bath

The present invention relates to a method for depositing an adherent zinc coating onto a zinc-containing magnesium alloy substrate in order to render the surface suitable for electroplating. The coatings are applied from a pyrophosphate-based zinc electrolyte solution containing a small quantity of fluoride ions. Depending on the zinc and aluminum content of the magnesium alloy, the zinc electrolyte solution is applied by immersion deposition or electrolytically.

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West Midlands, United Kingdom

Trevor Pearson