Xilinx, Inc.

Other

Trevor J Bauer

Steven P Young

Kamal Chaudhary

F Erich Goetting

Shekhar Bapat

Bruce E Talley

Bernard J New

Raymond C Pang

Roman Iwanczuk

Ramakrishna K Tanikella

Richard A Carberry

Jason R Bergendahl

Venu M Kondapalli

Sridhar Krishnamurthy

Paul Ying-Fung Wu

Manoj Chirania

Jeffrey V Lindholm

Warren Bauer

Patrick J McGuire

Martin L Voogel

Brian C Gaide

Suresh M Menon

Atul V Ghia

Peter H Alfke

Ping-Chen Liu

Paul T Sasaki

Philip D Costello

Christopher D Ebeling

Nicolas J Camilleri

William Edward Allaire

Kwansuhk Oh

Arthur Behiel

Ramakrishna Kishore Tanikella

Colm P Fewer

Bruce A Newgard

Stephen M Trimberger

Arifur Rahman

Philip Bryn James-Roxby

Prasanna Sundararajan

Rafael C Camarota

Matthew H Klein

Christopher H Kingsley

Eric R Keller

Derek R Curd

Robert W Wells

Dinesh D Gaitonde

Robert D Patrie

Richard William Swanson

Henri Fraisse

Scott P McMillan

P Hugo Lamarche

Andrew K Percey

Robert M Ondris

Richard J LeBlanc

Punit S Kalra

Vincent P Eck

Andy DeBaets

Stephen W Trynosky

Jonathan S Rose

Philip B James-roxby

Richard J Leblanc

Scott P Mcmillan

Brandon J Blodget

Methods and apparatus for the analysis of moving objects. In one embodiment, a pitch tracking system is disclosed that includes one or more cameras that have been positioned in a desired location and a computing system containing executable software that is configured to receive imaging data from the one or more cameras that captured the desired location and analyze seam placement and/or finger placement as a function of time for the received imaging data. Computer readable media and methodologies are also disclosed herein.

Systems and methods for the analysis of moving objects

Programmable devices and methods of operation are disclosed. In some embodiments, a programmable device may include programmable logic selectively coupled to a plurality of input/output (I/O) interface circuits by a programmable interconnect fabric and a network-on-chip (NoC) interconnect system. The programmable logic may include configurable logic elements, programmable interconnects, and dedicated circuitry. The programmable interconnects may form part of the programmable interconnect fabric. In some embodiments, the programmable interconnect fabric selectively routes non-packetized data between the programmable logic and a first group of I/O interface circuits, and the NoC interconnect system selectively routes packetized data between the programmable logic and a second group of I/O interface circuits. The NoC interconnect system may operate according to a data packet protocol, and the second group of I/O interface circuits may include memory controllers compatible with the data packet protocol.

Integrating rows of input/output blocks with memory controllers in a columnar programmable fabric archeture

A programmable logic device with fabric regularity is disclosed. For example, the programmable logic device may include a plurality of similar heterogeneous logic blocks. A user's design may be implemented within a first group of heterogeneous logic blocks. The user's design may be moved or copied to a second group of heterogeneous logic blocks. More specifically, routing, timing, and/or placement information associated with the implementation of the users design in the first group of heterogeneous logic blocks may be used to implement the user's design in the second group of heterogeneous logic blocks.

Regularity of fabrics in programmable logic devices

An apparatus includes an integrated circuit with a clock network in an array of circuit blocks. The clock network includes routing tracks, distribution spines, and clock leaves. The routing tracks and the distribution spines are bidirectional.

Clock network architecture

A method and apparatus to test the inter-die interface between two or more semiconductor die in die stacking applications, where a mismatch exists between the number of input and output pads on a base die and the number of input and output pads on a stacked die. In a first embodiment, a number of through-die vias (TDVs) may be used to implement inter-die signal paths using standard or flexible design rules to maintain statistical TDV yield despite the lack of continuity verification of the inter-die signals paths. In alternate embodiments, programmable multiplexers may be utilized to share one or more inter-die connections between the base die and the one or more stacked die so as to facilitate testing and normal operation of each inter-die connection. In other embodiments, spare TDVs are utilized only during test operations, so as to accommodate the mismatch. In yet other embodiments, built-in-test (BIT) circuits are configured to perform logic operations using a plurality of inter-die input/output (I/O) signals to eliminate the need to implement an identical number of input and output ports between the base die and the one or more stacked die to facilitate inter-die testing.

Method and apparatus for programmable device testing in stacked die applications

A programmable integrated circuit (IC) with mirrored interconnect structure. The IC includes a plurality of arrangements, which are horizontally arranged. Each arrangement includes a first logic column, an interconnect column, and a second logic column. Each interconnect column includes programmable interconnect blocks (), and each of the first and second logic columns includes programmable logic blocks. Each programmable interconnect block provides a plurality of first input and output ports on a first side and a plurality of second input and output ports on a second side. The first ports and the first side of each of the programmable interconnect blocks physically mirror the second ports and the second side of the programmable interconnect block. The ports of the programmable interconnect blocks are coupled to the ports of the programmable logic blocks in the first and second logic columns.

Programmable integrated circuit with mirrored interconnect structure

Circuits and methods for facilitating distribution of gated clocks in a programmable integrated circuit such as a field programmable gate array (FPGA) are described. Dynamic power savings are achieved in a FPGA by providing gated clock driver circuitry at various places in a hierarchical clock distribution network. The gated clock circuitry provides a clock signal gated by an enable signal to clocked elements. Configurable logic blocks (CLBs) comprising the clocked elements and programmable interconnect tiles are disposed in the gate array. Clock signals are distributed to the CLBs via a clock distribution network. Clock enable signals are provided corresponding to some of the clock signals. Clock buffers or drivers are provided within the clock distribution network that drive gated clock signals to CLBs. By disabling certain clocked elements using one or more embodiments of the invention when portions of the FPGA are inactive, dynamic power consumption is reduced.

Clock distribution to facilitate gated clocks

A method of modeling two IC dies using the same software model, although the two dies include physical differences. A first programmable logic device (PLD) die includes first and second portions, and is encoded to render the first portion operational and the second portion non-operational. At a boundary between the two portions, interconnect lines traversing the boundary include a first section in the first portion and a second section in the second portion. The second PLD die includes the first portion of the first PLD die, while omitting the second portion. The interconnect lines extending to the edge of the second die are coupled together in pairs. A software model for both die includes a termination model that omits the pair coupling, adds an RC load compensating for the omitted connection, and (for bidirectional interconnect lines) flags one interconnect line in each pair as being invalid for use by routing software.

Methods of implementing and modeling interconnect lines at optional boundaries in multi-product programmable IC dies

A columnar programmable device (PD) design converted to a columnar application specific integrated circuit-like (ASIC-like) design is described. A user design is instantiated in a PD having a columnar architecture associated with the columnar PD design. The columnar architecture has adjacent columns of circuitry, and one or more of the columns of circuitry as associated with instantiation of the user design in the PD are identified. At least a portion of one or more of the identified columns are swapped with application specific circuitry for implementing all or part of the user design for converting the columnar PD design to the columnar ASIC-like design.

Formation of columnar application specific circuitry using a columnar programmable device

Signal distribution of a regional signal is described. An integrated circuit includes a global signal distribution network, a regional signal distribution network and a regional buffer. The regional buffer has an output coupled at an end of the regional signal distribution network. The regional signal distribution network is coupled to a configurable logic block via an interconnect tile. The regional buffer is coupled to a regional clock capable input/output block. Additionally described is a source synchronous interface for regional signal distribution.

Regional signal-distribution network for an integrated circuit

Structures and methods of avoiding hold time violations in a design implemented in a PLD. In a programmable device, the delay of a signal path varies, e.g., depending on the separation between the source and destination of the signal. An optional delay element is provided between a programmable interconnect structure and a destination logic element having a clock skew relative to the source. The optional delay element is programmed by the implementation software to introduce a delay on the signal path when necessary to meet the hold time requirements for the destination logic element. The optional delay is designed to be large enough to overcome hold-time violations even for the largest possible clock skew and the smallest possible signal delay. When no hold time violation occurs, the optional delay element is configured to bypass the additional delay, to avoid imposing a large setup requirement on the signal.

Structures and methods to avoiding hold time violations in a programmable logic device

Methods of manufacturing a family of packaged integrated circuits (ICs) having at least two different logic capacities. A first IC die includes two different portions, of which at least one portion can be deliberately rendered non-operational in some manner (e.g., non-functional, inaccessible, and/or non-programmable) within the package. A first set of the first IC dies are packaged such that both portions of the dies are operational. A second set of the first IC dies are packaged such that only the first portion of each die is operational. Once the first and second sets are packaged and the second set of ICs has been evaluated, a decision is made whether or not to manufacture a second IC die that includes the first portion of the first die, while excluding the second portion.

Methods of providing a family of related integrated circuits of different sizes

An integrated circuit die (e.g., a programmable logic device (PLD) die) is manufactured that has the capability of being configured as at least two differently-sized family members. The IC die is tested prior to packaging. If a first portion of the IC die is fully functional, but a second portion includes a localized defect, then the IC die is packaged with a product selection code that configures the IC die to operate as only the first portion of the die. The second portion of the die is deliberately rendered non-operational. Therefore, the IC die can still be sold as a fully functional packaged IC.

Yield-enhancing methods of providing a family of scaled integrated circuits

Growing community of inventors

Boulder, CO, United States of America

Trevor J Bauer