Liquid Wire Inc.

Trevor Antonio Rivera

Mark William Ronay

Michael Adventure Hopkins

Charles J Kinzel

Jorge E Carbo

Edward Martin Godshalk

Sai Srinivas Desabathina

Katherine M Nelson

Jorge E Carbo Jr

A flexible differential strain sensor, system, and method includes a deformable substrate having a first axis and a second axis different than the first axis and a first sensing element and a second sensing element. The first and second sensing elements are comprised of conductive gel. The first sensing element is arranged to sense strain in the deformable substrate along the first axis. The second sensing element has a first portion arranged to sense strain in the deformable substrate along the first axis and a second portion arranged to sense strain in the deformable substrate along the second axis. The second sensing element is arranged to cancel at least a portion of the stimulus sensed by the first sensing element in the along the first axis.

Multi-axis differential strain sensor

A method may include providing a fluid material, solidifying the fluid material, providing a substrate, and depositing the solidified fluid material on the substrate. Providing the fluid material may include providing a mold, and filling the mold with the fluid material. Solidifying the fluid material may include solidifying the fluid material in a mold, and removing the solidified fluid material from the mold. Providing the substrate may include preparing the substrate for deposition of the solidified fluid material, and adjusting the temperature of the substrate. Depositing the solidified fluid material on the substrate may include fixturing the substrate, and loading the solidified fluid material in a deposition tool. The fluid material may include a liquid phase component, and a solid phase component. The solid phase component may include particles suspended in the liquid phase component. The liquid phase component may include a gallium alloy.

Deposition with solid feedstock

A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

Continuous interconnects between heterogeneous materials

A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

Structures with deformable conductors

A flexible hybrid electronic system and method includes a first structure and a second structure. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from conductive gel. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from conductive gel. The first structure is bonded to the second structure at an interconnect region, the first conductive trace is electrically coupled to the second conductive trace within the interconnect region, and the first electronic component is operatively coupled to the second electronic component.

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Portland, OR, United States of America

Trevor Antonio Rivera