Intel Corporation

Travis W LaJoie

Bernhard Sell

Abhishek A Sharma

Pei-Hua Wang

Chieh-Jen Ku

Van H Le

Tahir Ghani

Jack T Kavalieros

Fatih Hamzaoglu

Allen B Gardiner

Juan G Alzate Vinasco

Shem Ogadhoh

Umut Arslan

Hui Jae Yoo

Juan G Alzate-Vinasco

Nikhil Mehta

Akash Garg

Noriyuki Sato

Sarah Atanasov

Shu Zhou

Yu-Wen Huang

Gregory George

Yih Wang

Elliot Tan

Blake C Lin

Jared Stoeger

Matthew V Metz

Wilfred Gomes

Arnab Sen Gupta

Julie Rollins

Moshe Dolejsi

Chieh-jen Ku

James D Waldemer

Vinaykumar Hadagali

Willy Rachmady

Aaron D Lilak

Sean T Ma

Mark Armstrong

Miriam Ruth Reshotko

Urusa Alaan

Albert Chen

Abhishek Sharma

Pulkit Jain

Tobias Brown-Heft

Kimberly L Pierce

Thoe Michaelos

Yu-Jin Chen

Juan Alzate Vinasco

Abhishek Anil Sharma

Ting Chen

Jason Peck

Alekhya Nimmagadda

Matthieu Giraud-Carrier

An integrated circuit (IC) includes a first memory cell and a second memory cell. The first memory cell includes (i) a first transistor and (ii) a first capacitor coupled to the first transistor, where an upper electrode of the first capacitor is coupled to a first conductive structure. The second memory cell is above the first memory cell. The second memory cell includes (i) a second transistor and (ii) a second capacitor coupled to the second transistor. An upper electrode of the second capacitor is coupled to a second conductive structure. In an example, an interconnect feature includes a continuous and monolithic body of conductive material. In an example, the continuous and monolithic body extends through the second conductive structure, and further extends through the first conductive structure. In an example, the first and second memory cells are dynamic random access memory (DRAM) memory cells.

Punch-through interconnect feature to couple upper electrodes of capacitors of multi-level memory arrays

A device structure includes a first interconnect line along a longitudinal direction and a second interconnect line parallel to the first interconnect line, where the first interconnect structure is within a first metallization level and the second interconnect line is within a second metallization level. A first transistor and a laterally separated second transistor are on a same plane above the second interconnect line, where a gate of the first transistor is coupled to the first interconnect line and a gate of the second transistor is coupled to the second interconnect line. A first capacitor is coupled to a first terminal of the first transistor and a second capacitor is coupled to a first terminal of the second transistor. A third interconnect line couples a second terminal of the first transistor with a second terminal of the second transistor.

Multilevel wordline assembly for embedded DRAM

An integrated circuit includes a first conductive structure, a second conductive structure, and a first spacer and a second spacer each comprising a first dielectric material. The integrated circuit further includes a layer comprising a second dielectric material that is compositionally different from the first dielectric material. The integrated circuit further includes a first interconnect feature above and at least partially landed on the first conductive structure. In an example, the first interconnect feature is laterally between the first spacer and the second spacer. The integrated circuit further includes a second interconnect feature above and at least partially landed on the second conductive structure. In an example, the second interconnect feature is laterally between the second spacer and the layer comprising the second dielectric material.

Spacer-based self-aligned interconnect features

Embodiments herein describe techniques for a semiconductor device including a substrate. A first capacitor includes a first top plate and a first bottom plate above the substrate. The first top plate is coupled to a first metal electrode within an inter-level dielectric (ILD) layer to access the first capacitor. A second capacitor includes a second top plate and a second bottom plate, where the second top plate is coupled to a second metal electrode within the ILD layer to access the second capacitor. The second metal electrode is disjoint from the first metal electrode. The first capacitor is accessed through the first metal electrode without accessing the second capacitor through the second metal electrode. Other embodiments may be described and/or claimed.

Capacitor connections in dielectric layers

An example IC device includes a frontend layer and a backend layer with a metallization stack. The metallization stack includes a backend memory layer with a plurality of memory cells with backend transistors, and a layer with a plurality of conductive interconnects (e.g., a plurality of conductive lines) and air gaps between adjacent ones of the plurality of interconnects. Providing air gaps in upper metal layers of metallization stacks of IC devices may advantageously reduce parasitic effects in the IC devices because such effects are typically proportional to the dielectric constant of a surrounding medium. In turn, reduction in the parasitic effects may lead to improvements in performance of, or requirements placed on, the backend memory.

Backend memory with air gaps in upper metal layers

A thin film transistor (TFT) structure includes a gate electrode, a gate dielectric layer on the gate electrode, a channel layer including a semiconductor material with a first polarity on the gate dielectric layer. The TFT structure also includes a multi-layer material stack on the channel layer, opposite the gate dielectric layer, an interlayer dielectric (ILD) material over the multi-layer material stack and beyond a sidewall of the channel layer. The TFT structure further includes source and drain contacts through the interlayer dielectric material, and in contact with the channel layer, where the multi-layer material stack includes a barrier layer including oxygen and a metal in contact with the channel layer, where the barrier layer has a second polarity. A sealant layer is in contact with the barrier layer, where the sealant layer and the ILD have a different composition.

Passivation layers for thin film transistors

A device structure includes transistors on a first level in a first region and a first plurality of capacitors on a second level, above the first level, where a first electrode of the individual ones of the first plurality of capacitors are coupled with a respective transistor. The device structure further includes a second plurality of capacitors on the second level in a second region adjacent the first region, where individual ones of the second plurality of capacitors include a second electrode, a third electrode and an insulator layer therebetween, where the second electrode of the individual ones of the plurality of capacitors are coupled with a first interconnect on a third level above the second level, and where the third electrode of the individual ones of the plurality of capacitors are coupled with a second interconnect.

Decoupling capacitors and methods of fabrication

Described herein are two transistor (2T) memory cells that use TFTs as access and gain transistors. When one or both transistors of a 2T memory cell are implemented as TFTs, these transistors may be provided in different layers above a substrate, enabling a stacked architecture. An example 2T memory cell includes an access TFT provided in a first layer over a substrate, and a gain TFT provided in a second layer over the substrate, the first layer being between the substrate and the second layer (i.e., the gain TFT is stacked in a layer above the access TFT). Stacked TFT based 2T memory cells allow increasing density of memory cells in a memory array having a given footprint area, or, conversely, reducing the footprint area of the memory array with a given memory cell density.

Two transistor memory cell using stacked thin-film transistors

Disclosed herein are IC structures with three-dimensional capacitors with double metal electrodes provided in a support structure (e.g., a substrate, a die, a wafer, or a chip). An example three-dimensional capacitor includes first and second capacitor electrodes and a capacitor insulator between them. Each capacitor electrode includes a planar portion extending across the support structure and one or more via portions extending into one or more via openings in the support structure. The capacitor insulator also includes a planar portion and a via portion extending into the via opening(s). The planar portion of the capacitor electrodes are thicker than the via portions. Each capacitor electrode may be deposited using two deposition processes, such as a conformal deposition process for depositing the via portion of the electrode, and a sputter process for depositing the planar portion of the electrode.

Three-dimensional capacitors with double metal electrodes

An integrated circuit (IC) structure in a memory device is described. In an example, the IC structure includes a memory cell including a bitline (BL) extending along a first direction and a channel extending along a second direction above and diagonal to the BL. In the example, a wordline (WL) extends in a third direction perpendicular to the first direction of the BL and intersects with the channel to control a current in the channel along a gated channel length. In some examples, the channel is electrically coupled on a first side to a storage capacitor via a storage node contact (SNC) and on a second side to the BL via a bit line contact (BLC) located on an underside or backside of the channel.

Thin film transistors having a backside channel contact for high density memory

Disclosed herein are transistors, memory cells, and arrangements thereof. For example, in some embodiments, an integrated circuit (IC) structure may include a plurality of transistors, wherein the transistors are distributed in a hexagonally packed arrangement. In another example, in some embodiments, an IC structure may include a memory cell including an axially symmetric transistor coupled to an axially symmetric capacitor, wherein the axis of the transistor is aligned with the axis of the capacitor.

Transistors, memory cells, and arrangements thereof

Thin film transistors fabricated using a spacer as a fin are described. In an example, a method of forming a fin transistor structure includes patterning a plurality of backbone pillars on a semiconductor substrate. The method may then include conformally depositing a spacer layer over the plurality of backbone pillars and the semiconductor substrate. A spacer etch of the spacer layer is then performed to leave a sidewall of the spacer layer on a backbone pillar to form a fin of the fin transistor structure. Other embodiments may be described and claimed.

Fabrication of thin film fin transistor structure

Integrated circuit structures having differentiated interconnect lines in a same dielectric layer, and methods of fabricating integrated circuit structures having differentiated interconnect lines in a same dielectric layer, are described. In an example, an integrated circuit structure includes an inter-layer dielectric (ILD) layer above a substrate. A plurality of conductive interconnect lines is in the ILD layer. The plurality of conductive interconnect lines includes a first interconnect line having a first height, and a second interconnect line immediately laterally adjacent to but spaced apart from the first interconnect line, the second interconnect line having a second height less than the first height.

Integrated circuit structures having differentiated interconnect lines in a same dielectric layer

Embodiments herein describe techniques for a semiconductor device including a substrate, a first inter-level dielectric (ILD) layer above the substrate, and a second ILD layer above the first ILD layer. A first capacitor and a second capacitor are formed within the first ILD layer and the second ILD layer. A first top plate of the first capacitor and a second top plate of the second capacitor are formed at a boundary between the first ILD layer and the second ILD layer. The first capacitor and the second capacitor are separated by a dielectric area in the first ILD layer. The dielectric area includes a first dielectric area that is coplanar with the first top plate or the second top plate, and a second dielectric area above the first dielectric area and to separate the first top plate and the second top plate. Other embodiments may be described and/or claimed.

Capacitor separations in dielectric layers

Passivation layers for thin film transistors and methods of fabrication

Growing community of inventors

Forest Grove, OR, United States of America

Travis W LaJoie