Juniper Networks, Inc.

Travis S Mikjaniec

Henry K Sim

Mahesh Nagarajan

Gauri R Khanolkar

Katsuhiro Okamura

Brian J Ray

Elmer Tolentino

Susheela Nanjunda Rao Narasimhan

John B Kenney

Attila I Aranyosi

Sean Kim

Olaf Moeller

Marshall J Lise

Sriram Gopalaratnam

Daniel Fairchild Farmer

Amit Kumar Misra

A disclosed computing device capable of performing self-contained reliability testing may include (1) a cooling device and (2) circuitry communicatively coupled to the cooling device, wherein the circuitry is configured to (A) alternate between periods of high computing activity that increases heat emission and periods of low computing activity that decreases the heat emission and (B) direct the cooling device to decrease cooling power during the periods of high computing activity and increase the cooling power during the periods of low computing activity. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for performing self-contained reliability testing on computing devices

A disclosed Thermal Test Vehicle (TTV) for simulating the thermal characteristics of a certain integrated circuit may include (1) a substrate that serves as both (A) an electrical insulator that resists electrical energy and (B) a thermal conductor that conducts thermal energy and (2) one or more resistive elements coupled to the substrate, wherein the resistive elements extend across a majority of at least one dimension of the substrate. Various other apparatuses, systems, and methods are also disclosed.

Hybrid circuit thermal test vehicles, systems, and methods

The disclosed apparatus may include (1) a plurality of vapor chambers that (A) are mounted to a plurality of individual power components that dissipate heat within a computing device and (B) absorb heat dissipated by the plurality of individual power components within the computing device and (2) at least one thermal coupling that (A) physically bridges the plurality of vapor chambers to one another within the computing device and (B) facilitates heat transfer among the plurality of vapor chambers mounted to the individual power components. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for improved heat spreading in heatsinks

The disclosed apparatus may include may include (1) an active power supply blank that (A) fits within a power supply slot of a network device that forwards network traffic and (B) generates airflow that cools the network device and (2) a power interface that electrically couples the active power supply blank to the network device, wherein the power interface enables the active power supply blank to (A) draw electrical power from the network device and (B) generate the airflow that cools the network device using the electrical power drawn from the network device. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for cooling network devices via unused power supply slots

The disclosed apparatus may include (1) a faceplate that facilitates at least one connection between at least one communication cable and a line card that forwards traffic in connection with a network, (2) at least one heatsink that (A) is integrated into the faceplate and (B) absorbs heat dissipated by at least one electronic component included in the line card, and (3) at least one mount that (A) is integrated into the faceplate and (B) enables the electronic component to attach to the heatsink. Various other apparatuses and systems are also disclosed.

Apparatuses and systems for increasing thermal mass in line card heatsinks

Growing community of inventors

Fremont, CA, United States of America

Travis S Mikjaniec