Applied Materials, Inc.

Applied Materials Israel Limited

Travis Morey

Michael C Kuchar

Michael Robert Rice

Ofer Amir

Adam J Wyatt

Paul Benjamin Reuter

Angela Rose Sico

Andrew Nguyen

Jeffrey C Hudgens

James D Carducci

Nir Merry

Dean C Hruzek

Matthew Fenton Davis

Izya Kremerman

Robert Irwin Decottignies

Mitchell DiSanto

Eran Weiss

Nagendra V Madiwal

Eric Andrew Englhardt

Yoram Uziel

Sushant Suresh Koshti

Igor Krivts (Krayvitz)

Israel Avneri

Ayan Majumdar

Edward Ng

Steve S Hongkham

Natan Schlimoff

Robert M McAndrew

Erez Admoni

Kenneth J Bahng

William (Ty) Weaver

Kenneth J Bhang

Mainframe of dual-robot substrate processing system

Mainframe with integrated lid

Mainframe of substrate processing system

A load lock door assembly with side actuation is disclosed. Load lock door assembly includes a load lock door and a door support assembly coupled thereto. Door support assembly includes one or more pivot members pivotable relative to one or more sides of the load lock body, a door support bracket coupled to the load lock door, one or more separator side actuators coupled between the door support bracket being actuatable to separate the load lock door from a sealing surface, and one or more pivot side actuator operable to pivot the load lock door above or below the load lock entry. Load lock apparatus with side actuation, systems including one or more load lock door assemblies with side actuation, and methods of operating load lock door assemblies are provided, as are numerous other aspects.

Load lock door assemblies, load lock apparatus, electronic device processing systems, and methods

An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.

Gas systems and methods for chamber ports

Load lock door assembly, load lock apparatus, electronic device processing systems, and methods

Porous diffuser assemblies including multiple diffuser elements. The porous diffuser assemblies include a diffuser body, a diffuser base coupled to the diffuser body and forming a plenum there between, the diffuser base including a plurality of openings formed therein, and a porous diffuser element disposed in each of the plurality of openings wherein surfaces of the porous diffuser elements are exposed to the plenum. Gas purged chambers and methods of purging a chamber are disclosed, as are numerous other aspects.

High flow gas diffuser assemblies, systems, and methods

According to an embodiment of the invention, there is provided a system, comprising: a first chamber; a second chamber; a chuck; a movement system; wherein the first chamber comprises: a first element that has a first surface; a first chamber housing that comprises a second surface; wherein the first surface and the second surface come into proximity with each other at a first interface; a supporting element for supporting the chuck when the chuck is positioned within the first chamber; and a first dynamic seal formed at the first interface and is arranged to seal the first chamber from the movement system; wherein the second chamber comprises: a second chamber housing; a movement system that is arranged to introduce movement between (a) the first chamber housing and (b) the first element and the chuck; and a movement control element for mechanically coupling the first element to the movement system.

System and method for forming a sealed chamber

Transfer chamber gas purge apparatus are disclosed. The transfer chamber gas purge apparatus has a transfer chamber adapted to contain at least a portion of a transfer robot, the transfer chamber including side walls, a chamber lid, and a chamber floor, wherein the chamber lid has a plurality of distributed chamber inlets. The plurality of distributed chamber inlets may include diffusing elements. Laminar purge gas flow may be provided above the substrate. Systems and methods including a plurality of distributed chamber inlets are disclosed, as are numerous other aspects.

Transfer chamber gas purge apparatus, electronic device processing systems, and purge methods

Gas apparatus, systems, and methods for chamber ports

An apparatus for removing volatile residues from a substrate is provided. In one embodiment, an apparatus for removing halogen-containing residues from a substrate includes a chamber suitable for operating maintaining a vacuum therein and a heat module positioned to heat a substrate disposed in the chamber. The apparatus for removing halogen-containing residues from a substrate also includes at least one of A) a temperature controlled pedestal having a projection extending radially therefrom suitable for supporting the temperature control pedestal on a ledge of the chamber body, the projection thermally isolating the base from the chamber body; B) a pair of substrate holders that include two support flanges extending radially inward from an inner edge of an arc-shaped body, each support flange having a substrate support step that includes a sloped landing; or C) a domed window.

Apparatus for efficient removal of halogen residues from etched substrates

Growing community of inventors

Austin, TX, United States of America

Travis Morey