Harris Corporation

Travis L Kerby

Louis Joseph Rendek, Jr

Casey Philip Rodriguez

Michael Raymond Weatherspoon

Paul Brian Jaynes

C W Sinjin Smith

Charles J Newton

A method of making an electronic device includes forming a circuit layer on a liquid crystal polymer (LCP) substrate and having at least one solder pad. The method also includes forming an LCP solder mask having at least one aperture therein alignable with the at least one solder pad. The method further includes aligning and laminating the LCP solder mask and the LCP substrate together, then positioning solder paste in the at least one aperture. At least one circuit component may then be attached to the at least one solder pad using the solder paste.

Electronic device having a liquid crystal polymer solder mask and related devices

Method of making an electronic device having a liquid crystal polymer solder mask and related devices

A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a cover layer on the substrate and the electrically conductive pattern, and forming openings in the cover layer and being aligned with the electrically conductive pattern. The method also includes positioning an IC on the cover layer so that bond pads of the IC are aligned with the openings, and heating under pressure the cover layer to both mechanically secure and electrically interconnect the IC.

Method for making electronic device with cover layer with openings and related devices

A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (). At least one circuit component can be attached to the surface of the LCP circuit ().

Method of constructing a structural circuit

Growing community of inventors

Malabar, FL, United States of America

Travis L Kerby