Skyworks Solutions, Inc.

Conexant Systems, Inc.

Trang Trinh

John S Walley

Roberto Coccioli

Hassan S Hashemi

Shiaw Wen Chang

Evan S McCarthy

Roger J Forse

Scott A Griffith

Mohamed A Megahed

Larry D Vittorini

Thuy Tran

Pete Good

A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

Multiple chip module with integrated RF capabilities

According to one exemplary embodiment, a structure comprises a laminate substrate having a top surface for receiving a semiconductor die. The structure further comprises an antenna element situated on the top surface of the laminate substrate, where the antenna element is coupled to a laminate substrate bond pad. For example, the antenna element may also be coupled to the laminate substrate bond pad by a trace on the top surface of the laminate substrate. According to this exemplary embodiment, the structure further comprises a bonding wire that provides an electrical connection between the laminate substrate bond pad and a semiconductor die bond pad. For example, the input impedance of the antenna element coupled to the laminate substrate bond pad may match the output impedance at the semiconductor die bond pad. The structure may further comprise a capacitor coupled to the antenna element.

Embedded antenna and semiconductor die on a substrate in a laminate package

One exemplary embodiment is a structure comprising a laminate substrate having a top surface for receiving a semiconductor die. The exemplary structure further comprises an antenna element situated on a bottom surface of the laminate substrate, where the antenna element is suitable for connection to the semiconductor die. According to this exemplary embodiment, the structure further comprises a laminate substrate reference pad in the laminate substrate, where the laminate substrate reference pad is situated over the antenna element. The exemplary structure further comprises at least one laminate substrate reference via situated at a side of the antenna element. The at least one laminate substrate reference via can be electrically connected to the laminate substrate reference pad. The at least one laminate substrate reference via can be electrically coupled to a printed circuit board reference via in a printed circuit board.

Shielded antenna in a semiconductor package

VCO tuning curve compensated charge pump current synthesizer

A BALUN circuit comprising a lead network coupled to the positive phase output of a differential power amplifier, a negative phase output coupled to the negative phase output of the differential amplifier, and a delay element coupled in series with the lag network. The output of the lead network and the delay element are combined to form a single-ended output. The lag and lead networks may adjust the output impedances of the positive and negative phase outputs so that the output impedance of the single-ended output is set to a desired value. In one implementation, selected components of the lag and lead networks, and the delay element, comprise printed elements.

BALUN circuit for combining differential power amplifier outputs

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Cypress, CA, United States of America

Trang Trinh