Texas Instruments Corporation

Tracy S Paulsen

James L Conner

Rohit L Bhuva

Bao G Tran

Michael J Overlaur

Indumini W Ranmuthu

Manoj K Jain

An embodiment semiconductor structure includes a metal layer. The semiconductor structure also includes a redistribution layer (RDL) structure including an RDL platform and a plurality of RDL pillars disposed between the RDL platform and the metal layer. Additionally, the semiconductor structure includes an under-bump metal (UBM) layer disposed on the RDL platform and a solder bump disposed on the UBM layer, where the UBM layer, the RDL platform, and the RDL pillars form an electrical connection between the solder bump and the metal layer.

Semiconductor structure and method for wafer scale chip package

A method of testing a large integrated circuit (10) of modular design. Test equipment is connected to a dedicated testing pad section (20) for each circuit section (22, 24, 34) of each module (12, 14, 16). The circuit section under test is tested via the testing pad adjacent that circuit section. The test equipment is then stepped to the testing section for the next circuit section. When testing is completed, the testing section is then electrically isolated from the circuit sections to prevent interference with operation of the entire circuit (10).

Large integrated circuit with modulator probe structures

A large integrated circuit (10) of modular design, each module (12,14,16) having a circuit section (22,24,34) and a separate dedicated testing pad section (20). Each circuit module (12,14,16) can be individually functionally tested as an independent circuit with conventional prober equipment for defects. Each testing pad section (20) facilitates controlling the entire integrated circuit (10) so that the respective module circuit section (12,14,16) can be tested. Control circuitry (26) comprised of pass gates is provided to isolate the testing pad sections (20) from the operational portion (22,24,34) of the integrated circuit (10) when not under test. The present invention is ideally suited for large spatial light modulators, memory devices and other large sophisticated integrated circuits.

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Rowlett, TX, United States of America

Tracy S Paulsen