Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Tracy A Lang

Thomas A Saksa

Alexander N Govyadinov

Dennis Raymond Esterberg

Mark A Smith

Frank Perdicaro

Tracy J Evans

Jay Shields

Richard Hollon, Jr

Paul A Rubens

Susan L Wechsler

Derek J Whiteside

Mammie C Lee

Daniel L Severns

Dale R Magnuson

A method may include with a raster image processor, creating pretreatment plane rasterized image data from source image data and, with a plasma emitter, selectively applying a plasma treatment to a surface of a print media based on the pre-treatment plane rasterized image data. A printing device may include a raster image processor to execute an image analysis module to create pre-treatment plane rasterized image data from source image data and a plasma emitting device to selectively apply a plasma treatment to a surface of a print media based on the pre-treatment plane rasterized image data.

Selective application of plasma treatment

A fluid ejection device includes a fluid ejection chamber having a drop ejecting element therein, a first fluid channel to communicate a first fluid with the fluid ejection chamber, a second fluid channel to communicate a second fluid different than the first fluid with the fluid ejection chamber, and a fluid pump communicated with one of the first fluid channel and the second fluid channel. As such, the fluid ejection chamber is to selectively eject drops of the first fluid, the second fluid, and a combination of the first fluid and the second fluid therefrom.

Fluid ejection device

The present disclosure is drawn to printing systems. In one example, a printing system can include an electrode having a plurality of electrode protrusions associated therewith and a conductive plate. The electrode and conductive plate can be positioned with respect to one another to generate an electric field therebetween and to allow a media substrate to be positioned therebetween to be exposed to the electric field. Additionally, an inkjet print head can form a printed image on the media substrate after exposure to the electric field.

Printing systems

A manufacturer installs software by first partitioning storage media of the computing system into a first partition and a second partition. The manufacturer installs software bundles Into the second partition. Each software bundle is stored in form as an image. The manufacturer also installs bootable software and a user interface into the first partition. The bootable software and the user interface when run, operate to receive from a user a selection as to which of the software bundles to install in the computing system. The software bundle selected by the user is installed into the first partition while overwriting the bootable software and the user interface. After installation of the software bundle selected by the user, the bootable software, for example, can erase the installation software bundles in the second partition. This is done, for example, by overwriting the second partition with a blank file system.

Efficient data transfer during computing system manufacturing and installation

A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The substrate is mounted to an undersurface of the PC board and concentrically spaced from the PC board within the opening. An air gap occurs between the substrate and the PC board within the opening to substantially reduce heat conductivity into the PC board.

Heat conductive substrate mounted in PC board for transferring heat from

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Corvallis, OR, United States of America

Tracy A Lang