Ibiden Company Limited

Murata Manufacturing Co., Ltd.

Toyotaka Shimabe

Toshiki Furutani

Yukinobu Mikado

Shinobu Kato

Shunsuke Sakai

Ryuichiro Tominaga

Keisuke Shimizu

Yasuyuki Shimada

Masahiro Kaneko

Naoki Shimizu

Takeshi Tashima

A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate. The boundary portion has a width which is in a range of approximately 0.05 to approximately 2.0 mm.

Wiring board and method for manufacturing the same

A multilayer wiring board with built-in electronic components includes a substrate including an insulating material and having multiple opening portions, a first conductor layer formed on a surface of the substrate and having an opening portion such that the substrate has the opening portions inside the opening portion of the first conductor layer, multiple electronic components positioned in the opening portions of the substrate, and an insulating layer formed on the substrate such that the insulating layer is formed on the electronic components and on the first conductor layer. The opening portions are formed in the substrate such that the opening portions include two opening portions and that the substrate has a partition wall formed between the two opening portions.

Multilayer wiring board with built-in electronic component

A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and including internal electrodes, ceramic dielectric layers and a pair of external electrodes. The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 &#x3bc;m to 200 &#x3bc;m and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%.

Substrate with built-in capacitor and method for manufacturing substrate with built-in capacitor

A printed wiring board includes a substrate having first and second cavities, first electronic components accommodated in the first cavity, second electronic components accommodated in the second cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the first and second cavities. The substrate has a first projection structure partitioning the first components in the first cavity and a second projection structure partitioning the second components in the second cavity, and the first and second cavities and the first and second projection structures are formed in the substrate such that T&#x3c;Tand W&#x3c;Ware satisfied where Trepresents distance between the first components, Trepresents distance between the second components, Wrepresents width of edge of the first structure in the first cavity, Wrepresents width of edge of the second structure in the second cavity.

Printed wiring board

A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate.

A printed wiring board includes a core substrate having a cavity, multiple electronic components accommodated in the cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the cavity. The components include a first component, second component and third component, the core substrate has a first projection structure partitioning the first and second components in the cavity and a second projection structure partitioning the second and third components in the cavity, and the cavity and the first and second structures are formed in the substrate such that T&#x3c;Tand W&#x3c;Ware satisfied where Trepresents distance between the first and second components, Trepresents distance between the second and third components, Wrepresents width of edge of the first structure in the cavity, and Wrepresents width of edge of the second structure in the cavity.

A multilayer wiring board with a built-in electronic component includes a substrate, a conductor layer formed on surface of the substrate, one or more electronic components positioned in a cavity formed through the substrate, an insulating layer formed on the substrate such that the insulating layer is formed on the component in the cavity, and a wiring layer formed on the insulating layer. The conductor layer has an opening formed such that the cavity is formed in the opening of the conductor layer and that the conductor layer has a first side in the opening and a second side in the opening on the opposite side across the cavity, and the cavity is formed in the opening of the conductor layer such that width between the cavity and the first side of the conductor layer is greater than width between the cavity and the second side of the conductor layer.

Multilayer wiring board with built-in electronic component and method for manufacturing the same

A wiring board includes a substrate having a cavity, and an electronic component accommodated in the cavity of the substrate. The substrate has a thickness which is greater than a thickness of the electronic component such that a ratio of the thickness of the substrate to the thickness of the electronic component is set in a range of 0.3 or greater and 0.7 or less.

Growing community of inventors

Ogaki, Japan

Toyotaka Shimabe