Sumitomo Bakelite Company Limited

Toyosei Takahashi

Masakazu Kawata

Rie Takayama

Mitsuo Sugino

Junya Kusunoki

Toshihiro Sato

Takashi Hirano

Kensuke Nakamura

Takeshi Hosomi

Kazuto Oonami

Fumihiro Shiraishi

Seiji Oohashi

Hirohisa Dejima

Ryouichi Okada

A method of manufacturing a light receiving deviceincludes: providing a resin layercontaining a photo curing resin on a transparent substratewhere a plurality of transparent substrate portionsA are integrated so that the resin layer covers the transparent substrate; selectively irradiating the resin layerwith light, followed by a developing process, so that the resin layerremains in regions of the transparent substratewhich surround portions corresponding to regions facing light receiving portionsin the transparent substrate portionsA; dividing the transparent substrateinto units of transparent substrate portionsA so that a plurality of transparent substrate portionsA are obtained; dividing the base substrateinto units of base substrate portionsA so that a plurality of base substrate portionsA are obtained; and joining the base substrate portionsA and the transparent substrate portionsA via the resin layer

Method of manufacturing light receiving device

A light receiving deviceincludes a support substrateprovided thereon with a photodetectorincluding a photodetecting portionand a base substrateon which the photodetecting portionis placed; and a transparent substratedisposed so as to oppose the face of the support substrateon which the photodetectoris provided. Between the support substrateand the transparent substrate, a frame portionis provided so as to surround the photodetector. The frame portionis a photo-curing adhesive, and directly adhered to the transparent substrateand the support substrate. Such structure provides a light receiving device capable of exhibiting the desired performance, and a method of manufacturing such light receiving device can also be provided.

Light receiving device and method of manufacturing light receiving device

A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.

Resin composition, filling material, insulating layer and semiconductor device

An adhesive film used for bonding a semiconductor component or a liquid crystal display component with a substrate, the adhesive film being composed of a resin composition containing a curable resin and a filler, and the adhesive film showing a water vapor transmission rate of 30 [g/m&#xb7;24 h] or above, wherein the curable resin preferably contains photo-curable resin, thermosetting resin, or curable resin cured both by light and heat. The filler preferably contains a porous filler, the filler preferably has a mean void diameter of 0.1 to 5 nm, and the adhesive film preferably shows a water vapor transmission rate at 25&#xb0; C. of 4 [g/m&#xb7;24 h] or above.

Adhesive film

A semiconductor device comprises a semiconductor substrate comprised of an interposer having one surface and a semiconductor element provided on the one surface of the interposer, the semiconductor element including a light receiving portion for receiving light thereon; a transparent substrate having light-transmitting property and one surface facing the light receiving portion, the transparent substrate arranged in a spaced-apart relationship with the one surface of the interposer through a gap formed between the one surface of the interposer and the one surface of the transparent substrate; and a spacer formed in a shape of a frame, the spacer positioned between the one surface of the interposer and the one surface of the transparent substrate for regulating the gap, and the spacer having an inner surface and an outer surface, wherein the one surface of the interposer, the one surface of the transparent substrate and the inner surface of the spacer form a space which is hermetically sealed, and wherein the spacer has a wall including at least one thin wall portion and a thick wall portion other than the at least one thin wall portion, and a vapor permeability of the at least one thin wall portion is greater than a vapor permeability of the thick wall portion, wherein a vapor allowed to flow into the space through the wall of the spacer from an outside preferentially permeates from the space to the outside through the thin wall portion.

Semiconductor device

A curable flux which works as a flux during soldering and as a reinforcing material for the soldered portion after being cured by heating; a resist for soldering which coats a circuit pattern having a land for placing solder balls and is cured by heating after the soldering; a semiconductor package and a semiconductor device in which the curable flux is used for soldering and the soldered portion is reinforced with the flux by heating; processes for producing a semiconductor package and a semiconductor device comprising using the curable flux for soldering and curing the curable flux after the soldering to reinforce the soldered portion. The curable flux works as a flux during bonding solder balls to the semiconductor package and soldering the package to a printed circuit board and reinforces the soldered portion after being cured by heating after the soldering.

Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device

Growing community of inventors

Tokyo, Japan

Toyosei Takahashi