Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Toyokazu Yoshino

Katsuya Okamoto

Shinji Morimoto

Kouji Nakashima

Koji Nakashima

Hideki Yasuda

Shinobu Kamizuru

Shigeki Ogata

A camera cover includes a cover outer surface which is a convex curved surface of which a lowermost part in a vertical direction is downwardly projected in the vertical direction; a first region which is provided at a predetermined radius around a substantially lowermost point of the convex curved surface; and a second region which is provided on the cover outer surface other than at the first region. The second region includes a first hydrophilic region having hydrophilic properties, and the first region has lower hydrophilic properties than those of the second region.

Camera cover

A camera cover and camera capable of mitigating water drop and dirt adhesion and of ensuring image clarity are provided. A dome section () of the camera cover includes, on its outer surface (), a hydrophilic coating () made of an inorganic material whose main component is a silicon compound. The thickness of the hydrophilic coating () is 0.01 to 1 &#x3bc;m. Surface roughness Ra of the hydrophilic coating () is 0.06 &#x3bc;m or less.

Camera cover and camera

Provided is an FPC, which comprises an insulating layer, wiring layersandlaminated above and under the insulating layer, and a layer connection for connecting the wiring layersandelectrically. The layer connection is constituted to comprise: a conductor press-fit holeof a cone shape extending through the insulating layerand the upper and lower wiring layersandand expanded to the side of one wiring layer; and a conductorfilled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layerdeformed into the cone shape of the conductor press-fit hole, and is protruded from the other wiring lower layerto have its surface partially coated and jointed. As a result, the contact area between the wiring layersandand the conductorfilled in the conductor press-fit holecan be enlarged to retain the contact strength between the wiring layersandand the conductorsufficiently thereby to provide a high connection reliability for the layer connection.

Manufacturing method of flexible printed wiring board

A flexible printed wiring board has a configuration which is equipped with a solder resist portion formed by coating through the use of a screen printing method on a region including a component mounting portion of a conductor pattern, and a cover lay film pasted in such a manner that an outer circumference portion of an opening portion overlaps an upper portion of a circumference portion of the solder resist portion. A manufacturing method of a flexible printed wiring board of the invention has a configuration which is equipped with a conductor pattern forming process, a solder resist forming process, and a cover lay film pasting process.

Flexible printed wiring board and manufacturing method thereof

To provide an interlayer-connected, multi-layer flexible printed circuit board having high bonding reliability and most suitable for micropatterning the circuit layers in the device; and to provide a high-productivity method for fabricating the device. A multi-layer flexible printed circuit board, wherein a conductor is filled in the through-holes formed in the insulating layer in the direction of the thickness thereof so as to electrically interconnect the circuit layers formed on both faces of the insulating layer, and wherein the conductor contains inside it, a copper-core solder ball having a copper ball as a core thereof.

Multi-layer printed circuit board, and method for fabricating the same

A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at least on the surface thereof which is press-fitted into the hole to electrically conduct the circuit layer.

Multi-layered flexible print circuit board and manufacturing method thereof

A method of manufacturing fine pattern of the invention comprises (a) a step of manufacturing a master substrate having a film of precious metal or an alloy thereof formed as an insoluble electrode on the electrode, (b) a step of forming a fine pattern film on the insoluble electrode with anion type electro-deposition, and (c) a step of exfoliating and transferring the fine pattern film onto another substrate. Another method of manufacturing fine pattern further includes a step of manufacturing a master substrate, of which a surface is provided with at least a repeatedly reproducible sacrificial electrode. Still another method of manufacturing fine pattern includes a step of forming a pattern electrode on a conductive substrate by electro-forming, and transferring the electrode onto another substrate. Yet another method of manufacturing fine pattern includes a structure wherein a transparent section is provided in a portion of a master substrate in order to facilitate a positional alignment. The invention provides reliable and accurate mass production of fine-line and high-density films of fine pattern having good transfer ability and durability at low cost. A fine-line and high-density printed circuit board can be made at low cost with the methods of manufacturing fine pattern as disclosed above.

Growing community of inventors

Fukuoka, Japan

Toyokazu Yoshino