Texas Instruments Corporation

Sensata Technologies Massachusetts, Inc.

Toyokazu Ezura

Kiyokazu Ikeya

Hideyuki Takahashi

Hideki Sano

Yasushi Hibino

Yasushi Ishikawa

Yasuhiro Ochiai

Yasuhisa Tsukada

Fujio Katsumata

Hiroyuki Abe

Takeyoshi Atobe

This invention provides a socket for a circuit board that adds function of electrical resistive element to a contact. A socket includes a socket body extending at a longitudinal direction; and a plurality of contacts disposed in two lines along the longitudinal direction of the socket body. When a memory module is connected to the socket body, terminals formed on opposite surfaces of the memory module are electrically and elastically connected by the contacts. The contact includes a contact portion which contacts the terminal, a bent portion for generating an elastic force, and a base portion. The contact is made of a conductive metal having elastic properties, and the contact used for carrying signal is provided with a resistor of an electrical resistive material that is different from the conductive metal. The resistor is connected in a current path between the base portion and the terminal of the memory module.

Socket with integrated damping resistor

An electronic part mounting device including a main socket body ( ) having a plurality of contact parts ( ) mounted therein for making contact with a plurality of contact terminals ( ) on an electronic part ( ). Main socket body ( ) is adapted to work with a contact opening and closing tool ( ) with a holding part ( ) for removably mounting and dismounting an electronic part ( ) in the socket body ( ) and an actuator member ( ) having touch parts ( ) that engages and moves a tool positioning part ( ) on the socket body ( ) to cause opening and closing of contacts ( ).

Electronic part mounting device

A socket having a base ( ) which can removably mount a BGA package ( ) and a plurality of contact members ( ) which are arranged in conformity with the pattern of terminal solder balls ( ) of BGA package ( ) on base ( ) and which have a pair of arms ( ) and ( ) that are capable of opening or closing for pressure contact in the state of sandwiching each terminal of BGA package ( ). Partition walls ( ) are provided on slider ( ) which is capable of moving in a direction normal to the opening and closing direction of arms ( ) and ( ), the partition walls engage with the pairs of arms of the contact maker ( ) respectively, with the arms ( ) and ( ) being opened or closed by the movement of the partition wall.

Socket for removably mounting electronic parts having a plurality of conductive terminals such as BGA packages

A socket (,) includes a body (,) and a cover (,). Body (,) has a base (,) having a horizontally movable slide (,) thereon on which a BGA package can be mounted and a plurality of contact members (,) arranged on base (,) corresponding to a pattern of solder balls of the BGA package. Each of contact members (,) has a pair of spring arms (,) which can be opened and closed in response to movement of slide (,). In one embodiment, a cover (,) is vertically movable relative to body (,). The cover (,) has motion transfer portions (,) having a wedge shape which are engageable with tapered force receiving portions (,) of slide(,). As cover (,) is pushed down, engagement surfaces (,) of motion transfer portions (,) engage force receiving surfaces (,) of slide (,) and slide (,) moves so that arms (,) of contact members (,) are opened. In another embodiment, the motion transfer parts (,) are provided on a head (,) which has an air suction holder for a BGA package.

Electrical socket apparatus

A Plug-in socket assembly for use with a semiconductor integrated circuit package has a plurality of contact elements mounted on a support member. The contact elements are each formed with a spring portion, an elongated arm portion merging out of the spring portion to an inner lug portion engageable with a contact pin of the integrated circuit package and an outer lug portion in engagement with a housing member movable downwardly toward and upwardly away from the support member. The housing member is formed with an open space to receive the integrated circuit package therein and a carrier unit adapted to support the integrated circuit package is mounted on the support member and is movable relative to both the support and the housing members.

Growing community of inventors

Kawasaki, Japan

Toyokazu Ezura