Ibiden Company Limited

Toyoaki Tanaka

Hiroaki Kodama

Motoo Asai

Kazuhito Yamada

A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.

Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication

An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent in electric signal transmission reliability and which can transmit optical signal through an optical path for transmitting optical signal. The substrate for mounting an IC chip of the present invention is a substrate for mounting an IC chip comprising: a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mounted thereto, wherein an optical path for transmitting optical signal, which penetrates the substrate for mounting an IC chip, is disposed.

Substrate for mounting IC chip

The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, where conductor circuits and insulating layers are formed and layered, an optical element is mounted, an optical path for transmitting an optical signal is formed, wherein an optical element sealing layer is formed so as to make contact with the periphery of the above described optical element.

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Ibi-gun, Japan

Toyoaki Tanaka