Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Matsushita Industrial Co., Ltd.

Ikeuchii & Sato

Tousaku Nishiyama

Toshiyuki Asahi

Yukihiro Ishimaru

Masaru Watanabe

Yasuhiro Sugaya

Takashi Kitae

Seiji Karashima

Tsumoru Ohata

Tsutomu Mitani

Hiroaki Takezawa

Seiichi Nakatani

Takashi Ichiryu

Takeshi Nakayama

Tadashi Nakamura

Koichi Hirano

Osamu Shibata

Yoshiyuki Saito

Yutaka Taguchi

Tetsuyoshi Ogura

Fumio Echigo

Hideki Iwaki

Shozo Ochi

Yasuhiro Nakatani

Daizo Andoh

Yoji Ueda

Yoshinobu Idogawa

Yoshihiro Bessho

Takeshi Suzuki

Satoru Tomekawa

Tatsuo Ogawa

Tetsuyosi Ogura

Kiyoshi Kobata

Hiroshi Suzuki

Masaki Hirokoh

Tumoru Ohata

A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in componentincludes an insulating sheet substratewhich has an upper surface, a lower surfaceopposed to the upper surfaceand a side surfacewhich connects these surfaces. At least one wiringextends from the upper surface to the lower surface through the side surface, and an electronic componentis disposed within the sheet substrate.

Module with a built-in component, and electronic device with the same

A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.

Method for producing connection member

A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.

Circuit board with built-in electronic component and method for manufacturing the same

Connection member and mount assembly and production method of the same

The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole with a conductor, peeling mold-releasing films, compressing the dielectric substrate and forming metal foils. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity.

Method for manufacturing printed circuit board

A mount assembly which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly. The mount assembly () is obtained by connecting a photo-electro conversion device (), spherical semiconductor devices () and () and an electro-photo conversion device () through electrical-connection portions () so that a light received by the photo-electro conversion device () is amplified by the spherical semiconductor devices () and () and then emitted from the electro-photo conversion device ().

Mount assembly, optical transmission line and photoelectric circuit board

A semiconductor built-in millimeter-wave band module includes: an insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a high thermal conductivity substrate made of a dielectric material having thermal conductivity higher than the insulating substrate and laminated on one surface of the insulating substrate; a plurality of wiring patterns formed on the high thermal conductivity substrate and the insulating substrate; a semiconductor device operating at millimeter-wave band, which is arranged inside of the insulating substrate, is packaged on the high thermal conductivity substrate in a face-up manner, and is connected electrically with the wiring patterns; and a distributed constant circuit element and an active element provided on the semiconductor device. In this module, a void is provided inside of the insulating substrate and in the vicinity of a surface of the distributed constant circuit element and the active element. With this configuration, heat from the semiconductor device operating at a millimeter-wave band can be dissipated effectively and the semiconductor and other circuit components can be packaged with high density.

Semiconductor built-in millimeter-wave band module

A light reception/emission device built-in module with optical and electrical wiring combined therein includes: an optical waveguide layer including a core portion and a cladding portion; first and second wiring patterns formed on a main surface of the optical waveguide layer; a light reception device disposed inside the optical waveguide layer, the light reception device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the first wiring pattern; and a light emission device disposed inside the optical waveguide layer, the light emission device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the second wiring pattern. With this configuration, optical coupling between the optical waveguide and the light reception/emission device can be conducted precisely.

Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the module

A conductive adhesive agent of the invention contains an elution preventing film-forming agent , which becomes reactive after electric continuity through a conductive particle appeared in the conductive adhesive agent when a binder resin is being hardened, to thereby form an elution preventing film on a surface of the conductive particle . By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.

Conductive adhesive agent, packaging structure, and method for manufacturing the same structure

The present invention aims to provide a wiring substrate highly reliable in insulation and connection and a method for manufacturing the wiring substrate. A wiring substrate having two or more wiring layers, insulation layers interposed between the neighboring wiring layers and containing an organic resin, and a via formed in the insulation layers and extended between neighboring wiring layers. The via including functional substances, as well as some of the voids (first voids) where at least the organic resins from the insulation layers exist and the remaining voids (second voids) where a gas exists.

Wiring board and production method thereof

The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

Printed circuit board and method of manufacturing the same

The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

Conductive adhesive and packaging structure using the same

A conductive adhesive agent of the invention contains an elution preventing film-forming agent which becomes reactive after electric continuity through a conductive particle appeared in the conductive adhesive agent when a binder resin is being hardened, to thereby form an elution preventing film on a surface of the conductive particle By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.

Growing community of inventors

Nara, Japan

Tousaku Nishiyama